Sfoglia per Autore  

Opzioni
Mostrati risultati da 1 a 20 di 31
Titolo Data di pubblicazione Autore(i) File
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 1-gen-2018 D'Arrigo, G.; Mio, A.; Favaro, G.; Calabretta, M.; Sitta, A.; Sciuto, A.; Russo, M.; Calì, M.; Oliveri, M.; Rimini, E.
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers 1-gen-2018 D'Arrigo, G.; Christian, M.; Morandi, V.; Favaro, G.; Bongiorno, C.; Mio, A. M.; Russo, M.; Sitta, A.; Calabretta, M.; Sciuto, A.; Piccinini, E.; D'Urso, L.; Rizzoli, R.
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 1-gen-2019 Mirone, G.; Sitta, A.; D'Arrigo, G.; Calabretta, M.
Power Module Ceramic Substrates: mechanical characterization and modeling 1-gen-2020 Sitta, A; Renna, M; Messina, Aa; Mirone, G; D'Arrigo, G; Calabretta, M file da validare
Mechanical characterization and modeling of different pad structures 1-gen-2020 Calabretta, M.; Guarnera, D.; Sitta, A.; Renna, M.; Sciuto, A.; D'Arrigo, G.; Oliveri, S. M.; Sequenzia, G.
Thermal measurement and numerical analysis for automotive power modules 1-gen-2020 Sitta, A.; Renna, M.; Messina, A. A.; Sequenzia, G.; D'Arrigo, G.; Calabretta, M.
An integrated approach to optimize solder joint reliability 1-gen-2020 Sitta, A.; Russo, S.; Torrisi, M.; Messina, A. A.; D'Arrigo, G.; Sequenzia, G.; Renna, M.; Calabretta, M.
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 1-gen-2020 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 1-gen-2020 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 1-gen-2021 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Experimental characterization and modeling of power module warpage during assembly process 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 1-gen-2021 Mauromicale, G.; Sitta, A.; Calabretta, M.; Oliveri, S. M.; Sequenzia, G.
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Structural characterization of semiconductor multi-layer pad 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 1-gen-2021 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 1-gen-2021 Sitta, A.; Mauromicale, G.; Sequenzia, G.; Messina, A. A.; Renna, M.; Calabretta, M.
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Mostrati risultati da 1 a 20 di 31
Legenda icone

  •  file ad accesso aperto
  •  file disponibili sulla rete interna
  •  file disponibili agli utenti autorizzati
  •  file disponibili solo agli amministratori
  •  file sotto embargo
  •  nessun file disponibile