Sfoglia per Autore
Mechanical properties of amorphous Ge2Sb2Te5 thin layers
2018-01-01 D'Arrigo, G.; Mio, A.; Favaro, G.; Calabretta, M.; Sitta, A.; Sciuto, A.; Russo, M.; Calì, M.; Oliveri, M.; Rimini, E.
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers
2018-01-01 D'Arrigo, G.; Christian, M.; Morandi, V.; Favaro, G.; Bongiorno, C.; Mio, A. M.; Russo, M.; Sitta, A.; Calabretta, M.; Sciuto, A.; Piccinini, E.; D'Urso, L.; Rizzoli, R.
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates
2019-01-01 Mirone, G.; Sitta, A.; D'Arrigo, G.; Calabretta, M.
Power Module Ceramic Substrates: mechanical characterization and modeling
file da validare2020-01-01 Sitta, A; Renna, M; Messina, Aa; Mirone, G; D'Arrigo, G; Calabretta, M
Mechanical characterization and modeling of different pad structures
2020-01-01 Calabretta, M.; Guarnera, D.; Sitta, A.; Renna, M.; Sciuto, A.; D'Arrigo, G.; Oliveri, S. M.; Sequenzia, G.
Thermal measurement and numerical analysis for automotive power modules
2020-01-01 Sitta, A.; Renna, M.; Messina, A. A.; Sequenzia, G.; D'Arrigo, G.; Calabretta, M.
An integrated approach to optimize solder joint reliability
2020-01-01 Sitta, A.; Russo, S.; Torrisi, M.; Messina, A. A.; D'Arrigo, G.; Sequenzia, G.; Renna, M.; Calabretta, M.
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications
2020-01-01 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering
2020-01-01 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device
2021-01-01 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Experimental characterization and modeling of power module warpage during assembly process
2021-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization
2021-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter
2021-01-01 Mauromicale, G.; Sitta, A.; Calabretta, M.; Oliveri, S. M.; Sequenzia, G.
Silver sintering for silicon carbide die attach: Process optimization and structural modeling
2021-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization
2021-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Structural characterization of semiconductor multi-layer pad
2021-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect
2021-01-01 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling
2021-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package
2021-01-01 Sitta, A.; Mauromicale, G.; Sequenzia, G.; Messina, A. A.; Renna, M.; Calabretta, M.
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction
2021-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Titolo | Data di pubblicazione | Autore(i) | File |
---|---|---|---|
Mechanical properties of amorphous Ge2Sb2Te5 thin layers | 1-gen-2018 | D'Arrigo, G.; Mio, A.; Favaro, G.; Calabretta, M.; Sitta, A.; Sciuto, A.; Russo, M.; Calì, M.; Oliveri, M.; Rimini, E. | |
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers | 1-gen-2018 | D'Arrigo, G.; Christian, M.; Morandi, V.; Favaro, G.; Bongiorno, C.; Mio, A. M.; Russo, M.; Sitta, A.; Calabretta, M.; Sciuto, A.; Piccinini, E.; D'Urso, L.; Rizzoli, R. | |
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates | 1-gen-2019 | Mirone, G.; Sitta, A.; D'Arrigo, G.; Calabretta, M. | |
Power Module Ceramic Substrates: mechanical characterization and modeling | 1-gen-2020 | Sitta, A; Renna, M; Messina, Aa; Mirone, G; D'Arrigo, G; Calabretta, M | file da validare |
Mechanical characterization and modeling of different pad structures | 1-gen-2020 | Calabretta, M.; Guarnera, D.; Sitta, A.; Renna, M.; Sciuto, A.; D'Arrigo, G.; Oliveri, S. M.; Sequenzia, G. | |
Thermal measurement and numerical analysis for automotive power modules | 1-gen-2020 | Sitta, A.; Renna, M.; Messina, A. A.; Sequenzia, G.; D'Arrigo, G.; Calabretta, M. | |
An integrated approach to optimize solder joint reliability | 1-gen-2020 | Sitta, A.; Russo, S.; Torrisi, M.; Messina, A. A.; D'Arrigo, G.; Sequenzia, G.; Renna, M.; Calabretta, M. | |
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications | 1-gen-2020 | Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano | |
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering | 1-gen-2020 | Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano | |
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device | 1-gen-2021 | Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano | |
Experimental characterization and modeling of power module warpage during assembly process | 1-gen-2021 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization | 1-gen-2021 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter | 1-gen-2021 | Mauromicale, G.; Sitta, A.; Calabretta, M.; Oliveri, S. M.; Sequenzia, G. | |
Silver sintering for silicon carbide die attach: Process optimization and structural modeling | 1-gen-2021 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization | 1-gen-2021 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
Structural characterization of semiconductor multi-layer pad | 1-gen-2021 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect | 1-gen-2021 | Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano | |
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling | 1-gen-2021 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package | 1-gen-2021 | Sitta, A.; Mauromicale, G.; Sequenzia, G.; Messina, A. A.; Renna, M.; Calabretta, M. | |
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction | 1-gen-2021 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. |
Legenda icone
- file ad accesso aperto
- file disponibili sulla rete interna
- file disponibili agli utenti autorizzati
- file disponibili solo agli amministratori
- file sotto embargo
- nessun file disponibile