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Titolo Data di pubblicazione Autore(i) File
Study by electron spectroscopy for chemical analysis of silicon, SiO2 and Si3N4 surfaces treated with various CF4-containing plasmas 1-gen-1983 Licciardello, Antonino; Pignataro, Salvatore; Pànczèl, M. file da validare
Comparison of effects produced on solid surfaces by bombardment with neutrals or ions in the keV range 1-gen-1985 Licciardello, Antonino; Puglisi, Orazio Gaetano; Pignataro, Salvatore file da validare
CHARACTERIZATION AND RELIABILITY OF TI/NI/AU, TI/NI/AG AND TI/NI BACK-SIDE METALLIZATIONS IN THE DIE-BONDING OF POWER ELECTRONIC DEVICES 1-gen-1994 Scandurra, A; Porto, A; Mameli, L; Viscuso, O; Delbo, V; Pignataro, S file da validare
Breakdown voltages phenomena at molding compound-chip interface 1-gen-2000 Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S file da validare
Study of adhesion failure due to molding compound additives at chip surface in electronic devices 1-gen-2001 Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S file da validare
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom 1-gen-2001 Zafarana, Roberto; Scandurra, Antonino; Pignataro, Salvatore; Tenya, Yuichi; Yoshizumi, Akira file da validare
Corrosion inhibition of Al metal in microelectronic devices assembled in plastic packages 1-gen-2001 Scandurra, A; Curro, G; Frisina, F; Pignataro, S file da validare
Monolayers of simple organic molecules on silicon studied by surface tools 1-gen-2002 Scandurra, A; Renna, L; Cerofolini, G; Pignataro, S file da validare
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom 1-gen-2003 Zafarana, Roberto; Scandurra, Antonino; Pignataro, Salvatore; Tenya, Yuichi; Yoshizumi, Akira file da validare
Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices 1-gen-2004 Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S file da validare
Curing and electrical conductivity of conductive glues for die attach in microelectronics 1-gen-2006 Scandurra, A; Cavallaro, A; Pignataro, S; Tiziani, R; Gobbato, L; Cognetti, C file da validare
Tantalum nitride thin film resistors by low temperature reactive sputtering for plastic electronics 1-gen-2008 Scandurra, Antonino; Indelli, Giuseppe Francesco; Pignataro, BRUNO GIUSEPPE; Di Marco, Silvestra; Ausilia Di Stefano, Maria; Ravesi, Sebastiano; Pignataro, Salvatore file da validare
Materials science challenges in green high power density devices 1. The Ag loaded glues for die bonding. 1-gen-2009 Scandurra, Antonino; Indelli, Giuseppe Francesco; Zafarana, Roberto; Cavallaro, Angelo; Scrofani, Emanuele; Russo, Sebastiano; Paul Giry, Jean; Pignataro, Salvatore file da validare
Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics 1-gen-2010 Scandurra, A; Indelli, Gf; Sparta, Ng; Galliano, F; Ravesi, S; Pignataro, S file da validare
Patterned metallizations in perfluorosulphonate membranes by printing methods 1-gen-2012 Scandurra, A; Indelli, Gf; Pignataro, S file da validare
Mostrati risultati da 1 a 15 di 15
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