This paper presents a fully integrated DC-DC converter with on-chip double galvanic isolation. The converter exploits only two dice both fabricated in a 0.35-μm BCD technology with a thick-oxide back-end for 5-kV galvanic isolation. It uses a novel architecture to transmit power across two isolation barriers, which are performed by integrated capacitors and transformers. LC coupling inherently enables the resonant mode operation for the isolation network, thus increasing the conversion efficiency compared with merely series-connected isolation components. Measurements of the double isolated DC-DC converter, including a Schottky diode full-bridge rectifier, achieve 110-mW dc output power and a power efficiency of 17% setting 3.3 V for both power supply and output voltage.

A 100-mW fully integrated DC-DC converter with double galvanic isolation

Greco, Nunzio;Parisi, Alessandro;Lombardo, Pierpaolo;Palmisano, Giuseppe;Ragonese, Egidio
2017-01-01

Abstract

This paper presents a fully integrated DC-DC converter with on-chip double galvanic isolation. The converter exploits only two dice both fabricated in a 0.35-μm BCD technology with a thick-oxide back-end for 5-kV galvanic isolation. It uses a novel architecture to transmit power across two isolation barriers, which are performed by integrated capacitors and transformers. LC coupling inherently enables the resonant mode operation for the isolation network, thus increasing the conversion efficiency compared with merely series-connected isolation components. Measurements of the double isolated DC-DC converter, including a Schottky diode full-bridge rectifier, achieve 110-mW dc output power and a power efficiency of 17% setting 3.3 V for both power supply and output voltage.
2017
9781509050253
D-class oscillator; Electromagnetic simulations; Galvanic isolation; Integrated capacitor; Integrated circuits; Integrated transformer; Schottky diodes; Silicon technology; Instrumentation; Hardware and Architecture; Electrical and Electronic Engineering; Computer Networks and Communications
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.11769/321493
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