The presented analysis has been aimed to evaluate the impact of die solder and sintering solution for automotive power modules in terms of thermal behavior. First, dedicated temperature measurements have been performed to evaluate the module thermal impedance in the two cases. Then, a lumped equivalent networks has been calculated, by means of a dedicated numeric, and finally function structures have been extracted.
Thermal measurement and numerical analysis for automotive power modules
Sitta A.
;Sequenzia G.;
2020-01-01
Abstract
The presented analysis has been aimed to evaluate the impact of die solder and sintering solution for automotive power modules in terms of thermal behavior. First, dedicated temperature measurements have been performed to evaluate the module thermal impedance in the two cases. Then, a lumped equivalent networks has been calculated, by means of a dedicated numeric, and finally function structures have been extracted.File in questo prodotto:
| File | Dimensione | Formato | |
|---|---|---|---|
|
09152204.pdf
solo gestori archivio
Tipologia:
Versione Editoriale (PDF)
Dimensione
104.92 kB
Formato
Adobe PDF
|
104.92 kB | Adobe PDF | Visualizza/Apri |
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
