INDELLI, Giuseppe Francesco
INDELLI, Giuseppe Francesco
Università degli Studi di CATANIA
Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics
file da validare2010-01-01 Scandurra, A; Indelli, Gf; Sparta, Ng; Galliano, F; Ravesi, S; Pignataro, S
Materials science challenges in green high power density devices 1. The Ag loaded glues for die bonding.
file da validare2009-01-01 Scandurra, Antonino; Indelli, Giuseppe Francesco; Zafarana, Roberto; Cavallaro, Angelo; Scrofani, Emanuele; Russo, Sebastiano; Paul Giry, Jean; Pignataro, Salvatore
Molding Compounds Adhesion and Influence on Reliability of Plastic Packages for SiC-Based Power MOS Devices
file da validare2013-01-01 Scandurra, A; Indelli, Gf; Zafarana, R; Cavallaro, A; Scrofani, E; Giry, Jp; Russo, S; Bakowski, M
Patterned metallizations in perfluorosulphonate membranes by printing methods
file da validare2012-01-01 Scandurra, A; Indelli, Gf; Pignataro, S
Study of adhesion of molding compounds on differently treated copper surfaces
file da validare1996-01-01 Scandurra, A; Zafarana, R; Grasso, A; Pelligra, B; Indelli, Gf
Surface effects on the growth of solution processed pentacene thin films
file da validare2008-01-01 Musumeci, Chiara; Cascio, Claudia; Scandurra, Antonino; Indelli, Giuseppe F.; Bongiorno, Corrado; Ravesi, Sebastiano; Pignataro, BRUNO GIUSEPPE
Tantalum nitride thin film resistors by low temperature reactive sputtering for plastic electronics
file da validare2008-01-01 Scandurra, Antonino; Indelli, Giuseppe Francesco; Pignataro, BRUNO GIUSEPPE; Di Marco, Silvestra; Ausilia Di Stefano, Maria; Ravesi, Sebastiano; Pignataro, Salvatore
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics | 1-gen-2010 | Scandurra, A; Indelli, Gf; Sparta, Ng; Galliano, F; Ravesi, S; Pignataro, S | file da validare |
| Materials science challenges in green high power density devices 1. The Ag loaded glues for die bonding. | 1-gen-2009 | Scandurra, Antonino; Indelli, Giuseppe Francesco; Zafarana, Roberto; Cavallaro, Angelo; Scrofani, Emanuele; Russo, Sebastiano; Paul Giry, Jean; Pignataro, Salvatore | file da validare |
| Molding Compounds Adhesion and Influence on Reliability of Plastic Packages for SiC-Based Power MOS Devices | 1-gen-2013 | Scandurra, A; Indelli, Gf; Zafarana, R; Cavallaro, A; Scrofani, E; Giry, Jp; Russo, S; Bakowski, M | file da validare |
| Patterned metallizations in perfluorosulphonate membranes by printing methods | 1-gen-2012 | Scandurra, A; Indelli, Gf; Pignataro, S | file da validare |
| Study of adhesion of molding compounds on differently treated copper surfaces | 1-gen-1996 | Scandurra, A; Zafarana, R; Grasso, A; Pelligra, B; Indelli, Gf | file da validare |
| Surface effects on the growth of solution processed pentacene thin films | 1-gen-2008 | Musumeci, Chiara; Cascio, Claudia; Scandurra, Antonino; Indelli, Giuseppe F.; Bongiorno, Corrado; Ravesi, Sebastiano; Pignataro, BRUNO GIUSEPPE | file da validare |
| Tantalum nitride thin film resistors by low temperature reactive sputtering for plastic electronics | 1-gen-2008 | Scandurra, Antonino; Indelli, Giuseppe Francesco; Pignataro, BRUNO GIUSEPPE; Di Marco, Silvestra; Ausilia Di Stefano, Maria; Ravesi, Sebastiano; Pignataro, Salvatore | file da validare |