A polymeric composition for making semiconductor device packaging includes at least one epoxy resin, at least one curing agent in an amount between 30 and 110 parts by weight per 100 parts by weight of the epoxy resin, at least one silica-based reinforcing filler in an amount between 300 and 2300 parts by weight per 100 parts of the epoxy resin, and at least one control agent for a rheology of the polymeric composition. The at least one control agent may be substantially free from polar group...
The invention relates to a method of producing a protective inhibitor layer of moisture-generated corrosion for aluminum (Al) alloy metallization layers (1), particularly in semiconductor electronic devices. The method of this invention comprises chemically treating the metallization layer (1) in at least two steps using a mixture of concentrated nitric acid and trace phosphoric acid, in order to produce a thin protective phosphate layer (3). Alternatively, the method comprises dipping the el...