An embodiment relates to a device integrated on a semiconductor substrate of a type comprising at least one first portion for the integration of at least one microfluidic system, and a second portion for the integration of an additional circuitry. The microfluidic system comprises at least one cavity realized in a containment layer of the integrated device closed on top by at least one portion of a polysilicon layer, this polysilicon layer being a thin layer shared by the additional circuitry and the closing portion of the cavity realizing a piezoresistive membrane for the microfluidic system.
|Titolo:||INTEGRATED DEVICE OF THE TYPE COMPRISING AT LEAST A MICROFLUIDIC SYSTEM AND FURTHER CIRCUITRY AND CORRESPONDING INTEGRATION PROCESS|
|Data di pubblicazione:||2011|
|Appare nelle tipologie:||6.1 Brevetto|