The presented analysis has been aimed to evaluate the impact of die solder and sintering solution for automotive power modules in terms of thermal behavior. First, dedicated temperature measurements have been performed to evaluate the module thermal impedance in the two cases. Then, a lumped equivalent networks has been calculated, by means of a dedicated numeric, and finally function structures have been extracted.
|Titolo:||Thermal measurement and numerical analysis for automotive power modules|
SITTA, ALESSANDRO (Corresponding)
|Data di pubblicazione:||2020|
|Appare nelle tipologie:||4.1 Contributo in Atti di convegno|