SITTA, ALESSANDRO

SITTA, ALESSANDRO  

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Risultati 1 - 20 di 26 (tempo di esecuzione: 0.022 secondi).
Titolo Data di pubblicazione Autore(i) File
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. file da validare
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 1-gen-2020 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
An integrated approach to optimize solder joint reliability 1-gen-2020 Sitta, A.; Russo, S.; Torrisi, M.; Messina, A. A.; D'Arrigo, G.; Sequenzia, G.; Renna, M.; Calabretta, M.
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 1-gen-2021 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano file da validare
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 1-gen-2022 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. file da validare
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 1-gen-2020 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Experimental characterization and modeling of power module warpage during assembly process 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. file da validare
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 1-gen-2022 Sitta, A.; Mauromicale, G.; Corrente, G.; Messina, A. A.; Rundo, F.; Calabretta, M.; Sequenzia, G. file da validare
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 1-gen-2022 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. file da validare
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 1-gen-2023 Calabretta, M.; Sitta, A.; Messina, A. A.; Olivieri, S. M.; Sequenzia, G. file da validare
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 1-gen-2021 Mauromicale, G.; Sitta, A.; Calabretta, M.; Oliveri, S. M.; Sequenzia, G. file da validare
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 1-gen-2019 Mirone, G.; Sitta, A.; D'Arrigo, G.; Calabretta, M.
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers 1-gen-2018 D'Arrigo, G.; Christian, M.; Morandi, V.; Favaro, G.; Bongiorno, C.; Mio, A. M.; Russo, M.; Sitta, A.; Calabretta, M.; Sciuto, A.; Piccinini, E.; D'Urso, L.; Rizzoli, R.
Mechanical characterization and modeling of different pad structures 1-gen-2020 Calabretta, M.; Guarnera, D.; Sitta, A.; Renna, M.; Sciuto, A.; D'Arrigo, G.; Oliveri, S. M.; Sequenzia, G.
Mechanical Characterization of Power Electronics Solder Materials 1-gen-2022 Calabretta, M.; Sitta, A.; Messina, A. A.; Oliveri, S. M.; Sequenzia, G. file da validare
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 1-gen-2018 D'Arrigo, G.; Mio, A.; Favaro, G.; Calabretta, M.; Sitta, A.; Sciuto, A.; Russo, M.; Calì, M.; Oliveri, M.; Rimini, E.
Power Module Ceramic Substrates: mechanical characterization and modeling 1-gen-2020 Sitta, A; Renna, M; Messina, Aa; Mirone, G; D'Arrigo, G; Calabretta, M file da validare
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. file da validare
Silicon carbide die sintering layer: manufacturing process optimization and modeling 1-gen-2022 Calabretta, M.; Sitta, A.; Sequenzia, G. file da validare
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. file da validare