SITTA, ALESSANDRO
SITTA, ALESSANDRO
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization
2021-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering
2020-01-01 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
An integrated approach to optimize solder joint reliability
2020-01-01 Sitta, A.; Russo, S.; Torrisi, M.; Messina, A. A.; D'Arrigo, G.; Sequenzia, G.; Renna, M.; Calabretta, M.
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device
2021-01-01 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis
2022-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications
2020-01-01 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module
file da validare2024-01-01 Donetti, L.; Mauro, S.; Sequenzia, G.; Calabretta, M.; Sitta, A.
Experimental characterization and modeling of power module warpage during assembly process
2021-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices
file da validare2022-01-01 Sitta, A.; Mauromicale, G.; Corrente, G.; Messina, A. A.; Rundo, F.; Calabretta, M.; Sequenzia, G.
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application
2022-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow
file da validare2023-01-01 Calabretta, M.; Sitta, A.; Messina, A. A.; Olivieri, S. M.; Sequenzia, G.
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter
2021-01-01 Mauromicale, G.; Sitta, A.; Calabretta, M.; Oliveri, S. M.; Sequenzia, G.
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates
2019-01-01 Mirone, G.; Sitta, A.; D'Arrigo, G.; Calabretta, M.
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers
2018-01-01 D'Arrigo, G.; Christian, M.; Morandi, V.; Favaro, G.; Bongiorno, C.; Mio, A. M.; Russo, M.; Sitta, A.; Calabretta, M.; Sciuto, A.; Piccinini, E.; D'Urso, L.; Rizzoli, R.
Mechanical characterization and modeling of different pad structures
2020-01-01 Calabretta, M.; Guarnera, D.; Sitta, A.; Renna, M.; Sciuto, A.; D'Arrigo, G.; Oliveri, S. M.; Sequenzia, G.
Mechanical Characterization of Power Electronics Solder Materials
2022-01-01 Calabretta, M.; Sitta, A.; Messina, A. A.; Oliveri, S. M.; Sequenzia, G.
Mechanical properties of amorphous Ge2Sb2Te5 thin layers
2018-01-01 D'Arrigo, G.; Mio, A.; Favaro, G.; Calabretta, M.; Sitta, A.; Sciuto, A.; Russo, M.; Calì, M.; Oliveri, M.; Rimini, E.
Power Module Ceramic Substrates: mechanical characterization and modeling
file da validare2020-01-01 Sitta, A; Renna, M; Messina, Aa; Mirone, G; D'Arrigo, G; Calabretta, M
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction
2021-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Silicon carbide die sintering layer: manufacturing process optimization and modeling
2022-01-01 Calabretta, M.; Sitta, A.; Sequenzia, G.
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization | 1-gen-2021 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
| An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering | 1-gen-2020 | Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano | |
| An integrated approach to optimize solder joint reliability | 1-gen-2020 | Sitta, A.; Russo, S.; Torrisi, M.; Messina, A. A.; D'Arrigo, G.; Sequenzia, G.; Renna, M.; Calabretta, M. | |
| Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device | 1-gen-2021 | Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano | |
| Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis | 1-gen-2022 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
| Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications | 1-gen-2020 | Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano | |
| Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module | 1-gen-2024 | Donetti, L.; Mauro, S.; Sequenzia, G.; Calabretta, M.; Sitta, A. | file da validare |
| Experimental characterization and modeling of power module warpage during assembly process | 1-gen-2021 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
| Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices | 1-gen-2022 | Sitta, A.; Mauromicale, G.; Corrente, G.; Messina, A. A.; Rundo, F.; Calabretta, M.; Sequenzia, G. | file da validare |
| Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application | 1-gen-2022 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
| Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow | 1-gen-2023 | Calabretta, M.; Sitta, A.; Messina, A. A.; Olivieri, S. M.; Sequenzia, G. | file da validare |
| Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter | 1-gen-2021 | Mauromicale, G.; Sitta, A.; Calabretta, M.; Oliveri, S. M.; Sequenzia, G. | |
| Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates | 1-gen-2019 | Mirone, G.; Sitta, A.; D'Arrigo, G.; Calabretta, M. | |
| Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers | 1-gen-2018 | D'Arrigo, G.; Christian, M.; Morandi, V.; Favaro, G.; Bongiorno, C.; Mio, A. M.; Russo, M.; Sitta, A.; Calabretta, M.; Sciuto, A.; Piccinini, E.; D'Urso, L.; Rizzoli, R. | |
| Mechanical characterization and modeling of different pad structures | 1-gen-2020 | Calabretta, M.; Guarnera, D.; Sitta, A.; Renna, M.; Sciuto, A.; D'Arrigo, G.; Oliveri, S. M.; Sequenzia, G. | |
| Mechanical Characterization of Power Electronics Solder Materials | 1-gen-2022 | Calabretta, M.; Sitta, A.; Messina, A. A.; Oliveri, S. M.; Sequenzia, G. | |
| Mechanical properties of amorphous Ge2Sb2Te5 thin layers | 1-gen-2018 | D'Arrigo, G.; Mio, A.; Favaro, G.; Calabretta, M.; Sitta, A.; Sciuto, A.; Russo, M.; Calì, M.; Oliveri, M.; Rimini, E. | |
| Power Module Ceramic Substrates: mechanical characterization and modeling | 1-gen-2020 | Sitta, A; Renna, M; Messina, Aa; Mirone, G; D'Arrigo, G; Calabretta, M | file da validare |
| Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction | 1-gen-2021 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
| Silicon carbide die sintering layer: manufacturing process optimization and modeling | 1-gen-2022 | Calabretta, M.; Sitta, A.; Sequenzia, G. |