This work has investigated the impact of crystallographic structure on SnAgCu (SAC) solder reliability at print board circuit (PCB) level. A detailed reliability analysis has been performed on packages with different solder thickness. The correlation between experiments and Finite Element Model results explains how NiAu metallization and the reduction of solder thickness improve the solder joint reliability performances.
|Titolo:||An integrated approach to optimize solder joint reliability|
|Data di pubblicazione:||2020|
|Appare nelle tipologie:||4.1 Contributo in Atti di convegno|