Automotive market requires more and more power semiconductor modules for the realization of vehicle electrification. With respect to more conventional discrete packages, power modules have more complex manufacturing flow in which there are some process parameters that play a key role for a robust design, mechanical and hydraulic integration with the vehicle. Among these parameters, the flatness of the final product must be controlled in order to guarantee the mounting of power modules on cooling system and the proper working of thermal management. This paper would introduce the technology of liquid cooling solution for electrified vehicles’ power module, pointing out the importance of power module flatness. Then, it is proposed an experimental methodology to analyze the warpage behaviour during power at the different process steps and at the end of power module manufacturing. Measurements confirm that flatness is within admitted tolerance (200 μ m), highlighting the ceramic soldering process as the most critical for warpage modification.

Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow

Sitta A.;Sequenzia G.
2023

Abstract

Automotive market requires more and more power semiconductor modules for the realization of vehicle electrification. With respect to more conventional discrete packages, power modules have more complex manufacturing flow in which there are some process parameters that play a key role for a robust design, mechanical and hydraulic integration with the vehicle. Among these parameters, the flatness of the final product must be controlled in order to guarantee the mounting of power modules on cooling system and the proper working of thermal management. This paper would introduce the technology of liquid cooling solution for electrified vehicles’ power module, pointing out the importance of power module flatness. Then, it is proposed an experimental methodology to analyze the warpage behaviour during power at the different process steps and at the end of power module manufacturing. Measurements confirm that flatness is within admitted tolerance (200 μ m), highlighting the ceramic soldering process as the most critical for warpage modification.
978-3-031-15927-5
978-3-031-15928-2
Design
Flatness
Manufacturing
Power module
Tolerances
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.11769/540622
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