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SITTA, ALESSANDRO

SITTA, ALESSANDRO  

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Risultati 1 - 20 di 37 (tempo di esecuzione: 0.051 secondi).
Titolo Data di pubblicazione Autore(i) File
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 1-gen-2020 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
An integrated approach to optimize solder joint reliability 1-gen-2020 Sitta, A.; Russo, S.; Torrisi, M.; Messina, A. A.; D'Arrigo, G.; Sequenzia, G.; Renna, M.; Calabretta, M.
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 1-gen-2021 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Characterization and simulation of four bending test to estimate resin-copper adhesion 1-gen-2023 Sitta, A.; Mauromicale, G.; Torrisi, M. A.; Sequenzia, G.; D'Arrigo, G.; Calabretta, M.
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 1-gen-2022 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 1-gen-2020 Calabretta, Michele; Sitta, Alessandro; Oliveri, Salvatore Massimo; Sequenzia, Gaetano
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 1-gen-2024 Donetti, L.; Sitta, A.; Mauromicale, G.; Calabretta, M.; Mauro, S.; Sequenzia, G.
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 1-gen-2024 Donetti, L.; Mauro, S.; Sequenzia, G.; Calabretta, M.; Sitta, A.
Experimental characterization and modeling of power module warpage during assembly process 1-gen-2021 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 1-gen-2022 Sitta, A.; Mauromicale, G.; Corrente, G.; Messina, A. A.; Rundo, F.; Calabretta, M.; Sequenzia, G.
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 1-gen-2024 Amoroso, D. M.; Donetti, L.; Schifano, B.; Sitta, A.; Mauromicale, G.; Sequenzia, G.; Messina, A. A.; Rundo, F.; Calabretta, M.
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 1-gen-2022 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 1-gen-2023 Calabretta, M.; Sitta, A.; Messina, A. A.; Olivieri, S. M.; Sequenzia, G.
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 1-gen-2021 Mauromicale, G.; Sitta, A.; Calabretta, M.; Oliveri, S. M.; Sequenzia, G.
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 1-gen-2019 Mirone, G.; Sitta, A.; D'Arrigo, G.; Calabretta, M.
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers 1-gen-2018 D'Arrigo, G.; Christian, M.; Morandi, V.; Favaro, G.; Bongiorno, C.; Mio, A. M.; Russo, M.; Sitta, A.; Calabretta, M.; Sciuto, A.; Piccinini, E.; D'Urso, L.; Rizzoli, R.
Mechanical characterization and modeling of different pad structures 1-gen-2020 Calabretta, M.; Guarnera, D.; Sitta, A.; Renna, M.; Sciuto, A.; D'Arrigo, G.; Oliveri, S. M.; Sequenzia, G.
Mechanical Characterization of Power Electronics Solder Materials 1-gen-2022 Calabretta, M.; Sitta, A.; Messina, A. A.; Oliveri, S. M.; Sequenzia, G.
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 1-gen-2018 D'Arrigo, G.; Mio, A.; Favaro, G.; Calabretta, M.; Sitta, A.; Sciuto, A.; Russo, M.; Calì, M.; Oliveri, M.; Rimini, E.