Power modules development is becoming more and more important for switching applications, to improve electric and reliability performances. This paper presents an experimental-numerical method to characterize the reliability behavior of ACEPACKTM SMIT package, a top side-cooled module designed with a half bridge topology, which employs high-voltage silicon MOSFETs. The experimental test involves power cycling to study the reliability and thermal behavior. Then, a finite-element based model is developed to simulate test conditions, to calculate temperature behavior inside the package.

Reliability and Thermal Analysis of ACEPACK SMIT Power Module

Amoroso D. M.;Sequenzia G.;Sitta A.
2023-01-01

Abstract

Power modules development is becoming more and more important for switching applications, to improve electric and reliability performances. This paper presents an experimental-numerical method to characterize the reliability behavior of ACEPACKTM SMIT package, a top side-cooled module designed with a half bridge topology, which employs high-voltage silicon MOSFETs. The experimental test involves power cycling to study the reliability and thermal behavior. Then, a finite-element based model is developed to simulate test conditions, to calculate temperature behavior inside the package.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.11769/603370
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