Thermofluid-dynamic Performance Improvement of Power Electronics Cooling Systems through CFD Analysis

This study investigates the analysis and optimization of a cooling system for power modules (PM) utilized in automotive electrification, specifically those employing silicon carbide MOSFETs. Given the increasing significance of power semiconductors, ensuring their reliability is paramount. The effective handling of high-power densities is essential and requires the adoption of innovative thermal management techniques. The heat generated by substantial current flow can lead to power semiconductor module failures, particularly in high-temperature environments. While cooling techniques can enhance heat transfer rates, they require recirculation pumping systems that consume electrical power based on the pressure drop within the cooler. Consequently, identifying the optimal balance between maximizing heat transfer and minimizing pressure drop is critical for achieving the optimal performance of power semiconductor modules in various automotive applications.