PIGNATARO, Salvatore
PIGNATARO, Salvatore
SCIENZE CHIMICHE
Breakdown voltages phenomena at molding compound-chip interface
file da validare2000-01-01 Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S
CHARACTERIZATION AND RELIABILITY OF TI/NI/AU, TI/NI/AG AND TI/NI BACK-SIDE METALLIZATIONS IN THE DIE-BONDING OF POWER ELECTRONIC DEVICES
file da validare1994-01-01 Scandurra, A; Porto, A; Mameli, L; Viscuso, O; Delbo, V; Pignataro, S
Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices
file da validare2004-01-01 Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S
Comparison of effects produced on solid surfaces by bombardment with neutrals or ions in the keV range
file da validare1985-01-01 Licciardello, Antonino; Puglisi, Orazio Gaetano; Pignataro, Salvatore
Corrosion inhibition of Al metal in microelectronic devices assembled in plastic packages
file da validare2001-01-01 Scandurra, A; Curro, G; Frisina, F; Pignataro, S
Curing and electrical conductivity of conductive glues for die attach in microelectronics
file da validare2006-01-01 Scandurra, A; Cavallaro, A; Pignataro, S; Tiziani, R; Gobbato, L; Cognetti, C
Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics
file da validare2010-01-01 Scandurra, A; Indelli, Gf; Sparta, Ng; Galliano, F; Ravesi, S; Pignataro, S
Materials science challenges in green high power density devices 1. The Ag loaded glues for die bonding.
file da validare2009-01-01 Scandurra, Antonino; Indelli, Giuseppe Francesco; Zafarana, Roberto; Cavallaro, Angelo; Scrofani, Emanuele; Russo, Sebastiano; Paul Giry, Jean; Pignataro, Salvatore
Monolayers of simple organic molecules on silicon studied by surface tools
file da validare2002-01-01 Scandurra, A; Renna, L; Cerofolini, G; Pignataro, S
Patterned metallizations in perfluorosulphonate membranes by printing methods
file da validare2012-01-01 Scandurra, A; Indelli, Gf; Pignataro, S
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom
file da validare2003-01-01 Zafarana, Roberto; Scandurra, Antonino; Pignataro, Salvatore; Tenya, Yuichi; Yoshizumi, Akira
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom
file da validare2001-01-01 Zafarana, Roberto; Scandurra, Antonino; Pignataro, Salvatore; Tenya, Yuichi; Yoshizumi, Akira
Study by electron spectroscopy for chemical analysis of silicon, SiO2 and Si3N4 surfaces treated with various CF4-containing plasmas
file da validare1983-01-01 Licciardello, Antonino; Pignataro, Salvatore; Pànczèl, M.
Study of adhesion failure due to molding compound additives at chip surface in electronic devices
file da validare2001-01-01 Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S
Tantalum nitride thin film resistors by low temperature reactive sputtering for plastic electronics
file da validare2008-01-01 Scandurra, Antonino; Indelli, Giuseppe Francesco; Pignataro, BRUNO GIUSEPPE; Di Marco, Silvestra; Ausilia Di Stefano, Maria; Ravesi, Sebastiano; Pignataro, Salvatore
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| Breakdown voltages phenomena at molding compound-chip interface | 1-gen-2000 | Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S | file da validare |
| CHARACTERIZATION AND RELIABILITY OF TI/NI/AU, TI/NI/AG AND TI/NI BACK-SIDE METALLIZATIONS IN THE DIE-BONDING OF POWER ELECTRONIC DEVICES | 1-gen-1994 | Scandurra, A; Porto, A; Mameli, L; Viscuso, O; Delbo, V; Pignataro, S | file da validare |
| Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices | 1-gen-2004 | Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S | file da validare |
| Comparison of effects produced on solid surfaces by bombardment with neutrals or ions in the keV range | 1-gen-1985 | Licciardello, Antonino; Puglisi, Orazio Gaetano; Pignataro, Salvatore | file da validare |
| Corrosion inhibition of Al metal in microelectronic devices assembled in plastic packages | 1-gen-2001 | Scandurra, A; Curro, G; Frisina, F; Pignataro, S | file da validare |
| Curing and electrical conductivity of conductive glues for die attach in microelectronics | 1-gen-2006 | Scandurra, A; Cavallaro, A; Pignataro, S; Tiziani, R; Gobbato, L; Cognetti, C | file da validare |
| Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics | 1-gen-2010 | Scandurra, A; Indelli, Gf; Sparta, Ng; Galliano, F; Ravesi, S; Pignataro, S | file da validare |
| Materials science challenges in green high power density devices 1. The Ag loaded glues for die bonding. | 1-gen-2009 | Scandurra, Antonino; Indelli, Giuseppe Francesco; Zafarana, Roberto; Cavallaro, Angelo; Scrofani, Emanuele; Russo, Sebastiano; Paul Giry, Jean; Pignataro, Salvatore | file da validare |
| Monolayers of simple organic molecules on silicon studied by surface tools | 1-gen-2002 | Scandurra, A; Renna, L; Cerofolini, G; Pignataro, S | file da validare |
| Patterned metallizations in perfluorosulphonate membranes by printing methods | 1-gen-2012 | Scandurra, A; Indelli, Gf; Pignataro, S | file da validare |
| Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom | 1-gen-2003 | Zafarana, Roberto; Scandurra, Antonino; Pignataro, Salvatore; Tenya, Yuichi; Yoshizumi, Akira | file da validare |
| Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom | 1-gen-2001 | Zafarana, Roberto; Scandurra, Antonino; Pignataro, Salvatore; Tenya, Yuichi; Yoshizumi, Akira | file da validare |
| Study by electron spectroscopy for chemical analysis of silicon, SiO2 and Si3N4 surfaces treated with various CF4-containing plasmas | 1-gen-1983 | Licciardello, Antonino; Pignataro, Salvatore; Pànczèl, M. | file da validare |
| Study of adhesion failure due to molding compound additives at chip surface in electronic devices | 1-gen-2001 | Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S | file da validare |
| Tantalum nitride thin film resistors by low temperature reactive sputtering for plastic electronics | 1-gen-2008 | Scandurra, Antonino; Indelli, Giuseppe Francesco; Pignataro, BRUNO GIUSEPPE; Di Marco, Silvestra; Ausilia Di Stefano, Maria; Ravesi, Sebastiano; Pignataro, Salvatore | file da validare |