SEQUENZIA, GAETANO
 Distribuzione geografica
Continente #
EU - Europa 246
AS - Asia 43
NA - Nord America 25
AF - Africa 15
SA - Sud America 1
Totale 330
Nazione #
IT - Italia 185
FR - Francia 33
US - Stati Uniti d'America 23
CI - Costa d'Avorio 14
CN - Cina 13
DE - Germania 10
HK - Hong Kong 9
IE - Irlanda 7
KR - Corea 6
JP - Giappone 4
IN - India 3
AT - Austria 2
EE - Estonia 2
GB - Regno Unito 2
MY - Malesia 2
PH - Filippine 2
SG - Singapore 2
BR - Brasile 1
CA - Canada 1
CZ - Repubblica Ceca 1
ET - Etiopia 1
FI - Finlandia 1
GR - Grecia 1
HN - Honduras 1
NL - Olanda 1
RU - Federazione Russa 1
TW - Taiwan 1
VN - Vietnam 1
Totale 330
Città #
Catania 43
Vittoria 38
Milan 18
Misterbianco 18
Abidjan 14
Dublin 7
Aci Catena 5
Central 5
Florence 5
Piedimonte Etneo 5
Columbus 4
Dresden 4
Rome 4
Shanghai 4
Verona 4
Casalmaggiore 3
Castel di Sangro 3
Guangzhou 3
Marseille 3
Turin 3
Bari 2
Boardman 2
Castelnuovo Rangone 2
Como 2
Dolo 2
George Town 2
Hamburg 2
Kowloon 2
Los Angeles 2
Mestre 2
Paris 2
Syracuse 2
Trece Martires City 2
Vienna 2
Ashburn 1
Berlin 1
Bury St Edmunds 1
Capri Leone 1
Caserta 1
Cirié 1
Darmstadt 1
Delhi 1
Dozza 1
Grenoble 1
Ho Chi Minh City 1
Hsinchu 1
Jesolo 1
Jongno-gu 1
Lappeenranta 1
London 1
Merate 1
Minatomirai 1
Neu-Hohenschoenhausen 1
Piraeus 1
Pisa 1
Pomezia 1
Riposto 1
San Diego 1
San Jose 1
Santa Clara 1
Santa Maria a Monte 1
Sao Vicente 1
Segrate 1
Stuttgart 1
Suwon 1
Terlizzi 1
Yokohama 1
Yuseong-gu 1
Totale 255
Nome #
Silver sintering for silicon carbide die attach: Process optimization and structural modeling, file dfe4d22e-829a-bb0a-e053-d805fe0a78d9 98
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device, file dfe4d22e-621f-bb0a-e053-d805fe0a78d9 50
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect, file dfe4d22e-621d-bb0a-e053-d805fe0a78d9 31
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter, file dfe4d22e-50e6-bb0a-e053-d805fe0a78d9 16
Advances on mechanics, design engineering and manufacturing, file 667fa1df-9809-46ce-bcc2-6eb79cf33826 15
Structural characterization of semiconductor multi-layer pad, file dfe4d22e-89b2-bb0a-e053-d805fe0a78d9 10
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization, file dfe4d22e-c2a6-bb0a-e053-d805fe0a78d9 10
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines., file dfe4d227-7202-bb0a-e053-d805fe0a78d9 8
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization, file dfe4d22e-94d3-bb0a-e053-d805fe0a78d9 7
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling, file dfe4d22e-9807-bb0a-e053-d805fe0a78d9 6
An effective model for the sliding contact forces in a multibody environment, file dfe4d227-7a23-bb0a-e053-d805fe0a78d9 5
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction, file dfe4d22e-01f4-bb0a-e053-d805fe0a78d9 5
Geometric modeling and modal stress formulation for flexible multi-body dynamic analysis of crankshaft, file dfe4d227-52bc-bb0a-e053-d805fe0a78d9 4
A cockroach-inspired hexapod robot: performance enhancement through dynamic simulation, file dfe4d227-e246-bb0a-e053-d805fe0a78d9 4
Meshing angles evaluation of silent chain drive by numerical analysis and experimental test, file dfe4d228-684a-bb0a-e053-d805fe0a78d9 4
The “Guerriero di Castiglione”: reconstructing missing elements with integrated non-destructive 3D modelling techniques, file dfe4d227-1f36-bb0a-e053-d805fe0a78d9 3
Dynamical modeling and design optimization of a cockroach-inspired hexapod, file dfe4d227-9edd-bb0a-e053-d805fe0a78d9 3
Flexible Multibody Model of Desmodromic Timing System, file dfe4d228-684b-bb0a-e053-d805fe0a78d9 3
An Integrated Approach for Shape Optimization with Mesh-Morphing, file dfe4d229-ac27-bb0a-e053-d805fe0a78d9 3
The reliability challenge of SiC Power Modules in Automotive Applications, file b2c94adf-a295-4846-af2a-4020c65cc66c 2
OTTIMIZZAZIONE DELLE TOLLERANZE DI ACCOPPIAMENTO IN UN ASSE A CAMME CON BOCCIOLI RIPORTATI, file dfe4d227-a6cd-bb0a-e053-d805fe0a78d9 2
UN KIT AUTOLIVELLANTE PER MACCHINE TREBBIATRICI, file dfe4d227-b57c-bb0a-e053-d805fe0a78d9 2
An advanced multibody model for evaluating rider’s influence on motorcycle dynamics, file dfe4d227-b6f5-bb0a-e053-d805fe0a78d9 2
SVILUPPO D I UNA METODOLOGIA PER LA MODELLAZIONE GEOMETRICA IN AMBIENTE MULTIBODY DI UN TENDITORE MECCANICO AD ALTA DEFORMABILITA', file dfe4d227-b72f-bb0a-e053-d805fe0a78d9 2
An integrated approach to customize the packaging of heritage artefacts, file dfe4d228-6848-bb0a-e053-d805fe0a78d9 2
Alternative elliptic integral solution to the beam deflection equations for the design of compliant mechanisms, file dfe4d22a-f5bc-bb0a-e053-d805fe0a78d9 2
Interactive re-design of a novel variable geometry bicycle saddle to prevent neurological pathologies, file dfe4d22a-fb63-bb0a-e053-d805fe0a78d9 2
A method for similarity assessment between death masks and portraits through linear projection: The case of Vincenzo Bellini, file dfe4d22b-05cc-bb0a-e053-d805fe0a78d9 2
A computer-based method to reproduce and analyse ancient series-produced moulded artefacts, file dfe4d22d-fcbe-bb0a-e053-d805fe0a78d9 2
Dynamic behaviour modelling of an internal combustion engine water pump transmission belt drive, file dfe4d22e-7cc9-bb0a-e053-d805fe0a78d9 2
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow, file 510a8860-020e-48ae-b86b-eecf3b87de99 1
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices, file 81f91ac7-aef1-4cc5-bdb8-0795606e2816 1
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop, file 93bcc69c-a9cb-4055-88ef-e1e13e4e6491 1
Experimental characterization and modeling of power module warpage during assembly process, file a0822392-d41c-4ded-af37-d86f08511bd5 1
Un motoveicolo per diversamente abili, file dfe4d227-7d27-bb0a-e053-d805fe0a78d9 1
GEOMETRIC AND MULTIBODY MODELING OF RIDER-MOTORCYCLE SYSTEM, file dfe4d227-8dec-bb0a-e053-d805fe0a78d9 1
Ricostruzione tridimensionale del circolo cerebrale nel sistema stereotassico, file dfe4d227-e02a-bb0a-e053-d805fe0a78d9 1
Tecniche di R.P. e R.E. applicate alla ricostruzione di reperti archeologici, file dfe4d227-e4cb-bb0a-e053-d805fe0a78d9 1
Virtual anthropology and rapid prototyping: A study of Vincenzo Bellini's death masks in relation to autopsy documentation, file dfe4d228-63fb-bb0a-e053-d805fe0a78d9 1
Experimental methodology for the tappet characterization of timing system in I.C.E., file dfe4d228-684c-bb0a-e053-d805fe0a78d9 1
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering, file dfe4d22a-2b8b-bb0a-e053-d805fe0a78d9 1
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications, file dfe4d22a-2c93-bb0a-e053-d805fe0a78d9 1
Modified chain algorithm to study planar compliant mechanisms, file dfe4d22b-1ac0-bb0a-e053-d805fe0a78d9 1
Dynamics of a high-performance motorcycle by an advanced multibody/control co-simulation, file dfe4d22c-bd37-bb0a-e053-d805fe0a78d9 1
Thermal measurement and numerical analysis for automotive power modules, file dfe4d22d-ea44-bb0a-e053-d805fe0a78d9 1
Mechanical characterization and modeling of different pad structures, file dfe4d22d-f0bf-bb0a-e053-d805fe0a78d9 1
An integrated approach to optimize solder joint reliability, file dfe4d22e-1f1f-bb0a-e053-d805fe0a78d9 1
Redesign and multibody simulation of a motorcycle rear suspension with eccentric mechanism, file dfe4d22e-3587-bb0a-e053-d805fe0a78d9 1
Mechanical Characterization of Power Electronics Solder Materials, file dfe4d22e-7928-bb0a-e053-d805fe0a78d9 1
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application, file dfe4d22e-8daf-bb0a-e053-d805fe0a78d9 1
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package, file dfe4d22e-9809-bb0a-e053-d805fe0a78d9 1
Silicon carbide die sintering layer: manufacturing process optimization and modeling, file dfe4d22e-d500-bb0a-e053-d805fe0a78d9 1
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis, file dfe4d22e-d6ac-bb0a-e053-d805fe0a78d9 1
Totale 330
Categoria #
all - tutte 736
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 736


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/20207 0 0 0 0 0 0 0 0 0 1 6 0
2020/20216 1 0 0 0 0 1 2 1 1 0 0 0
2022/2023165 3 1 2 12 21 11 10 23 27 5 38 12
2023/2024138 14 29 18 8 2 17 14 15 10 8 3 0
Totale 330