IRIS
SEQUENZIA, GAETANO
 Distribuzione geografica
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Continente #
NA - Nord America 3.119
EU - Europa 1.557
AS - Asia 1.396
AF - Africa 310
SA - Sud America 222
OC - Oceania 1
Totale 6.605
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Nazione #
US - Stati Uniti d'America 3.051
SG - Singapore 734
RU - Federazione Russa 684
CN - Cina 446
IT - Italia 385
IE - Irlanda 199
BR - Brasile 181
CI - Costa d'Avorio 175
SN - Senegal 106
UA - Ucraina 82
CA - Canada 54
VN - Vietnam 54
KR - Corea 52
NL - Olanda 37
GB - Regno Unito 31
DE - Germania 30
PL - Polonia 27
AR - Argentina 21
FI - Finlandia 19
IN - India 19
JP - Giappone 19
HK - Hong Kong 18
SE - Svezia 17
ES - Italia 10
FR - Francia 10
ZA - Sudafrica 10
TW - Taiwan 8
GR - Grecia 7
MX - Messico 7
TR - Turchia 7
AT - Austria 6
BD - Bangladesh 6
NG - Nigeria 6
EC - Ecuador 5
BJ - Benin 4
CH - Svizzera 4
CL - Cile 4
ID - Indonesia 4
IQ - Iraq 4
IR - Iran 4
AZ - Azerbaigian 3
CO - Colombia 3
LT - Lituania 3
MA - Marocco 3
PS - Palestinian Territory 3
UY - Uruguay 3
BE - Belgio 2
JM - Giamaica 2
KZ - Kazakistan 2
LB - Libano 2
MY - Malesia 2
PA - Panama 2
PE - Perù 2
PH - Filippine 2
SA - Arabia Saudita 2
UZ - Uzbekistan 2
VE - Venezuela 2
AE - Emirati Arabi Uniti 1
AU - Australia 1
BG - Bulgaria 1
BS - Bahamas 1
DO - Repubblica Dominicana 1
DZ - Algeria 1
EE - Estonia 1
GN - Guinea 1
JO - Giordania 1
KE - Kenya 1
MT - Malta 1
MU - Mauritius 1
NO - Norvegia 1
PK - Pakistan 1
PR - Porto Rico 1
PY - Paraguay 1
TN - Tunisia 1
ZW - Zimbabwe 1
Totale 6.605
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Città #
Dallas 844
Santa Clara 474
Singapore 445
Chandler 385
Moscow 297
Dublin 199
Abidjan 175
Hefei 121
Boardman 109
Chicago 108
Ashburn 107
Dakar 106
Jacksonville 100
Beijing 84
Catania 77
Los Angeles 71
Lawrence 53
Cambridge 52
Civitanova Marche 52
Seoul 52
Andover 47
Amsterdam 32
Toronto 32
Des Moines 30
Nanjing 27
Wilmington 25
Council Bluffs 24
Milan 23
Warsaw 21
New York 20
The Dalles 18
Columbus 17
Nanchang 17
Ho Chi Minh City 16
Hong Kong 16
Lappeenranta 15
San Jose 15
Buffalo 14
Denver 14
São Paulo 14
Tokyo 14
Rome 13
San Francisco 12
Boston 11
Falls Church 11
Hanoi 11
Hebei 11
Saint Petersburg 11
Tremestieri Etneo 11
Brooklyn 10
Orem 10
Ottawa 10
San Mateo 10
Duncan 9
Montreal 9
Poplar 9
Seattle 9
Houston 8
Shenyang 8
Chennai 7
Liberty Lake 7
Munich 7
Scicli 7
Shanghai 7
Abuja 6
Atlanta 6
Bari 6
Frankfurt am Main 6
Johannesburg 6
Sortino 6
Stockholm 6
Barlassina 5
Mascali 5
Messina 5
Aci Catena 4
Changsha 4
Cotonou 4
Florence 4
Gravina di Catania 4
Helsinki 4
Hải Dương 4
Jiaxing 4
London 4
Manchester 4
Mexico City 4
Nicosia 4
Nova Iguaçu 4
Phoenix 4
Porto Alegre 4
Pune 4
Santa Margherita 4
Taipei 4
Tehran 4
Avellino 3
Baghdad 3
Baku 3
Barueri 3
Bologna 3
Bra 3
Brasília 3
Totale 4.734
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Nome #
A cockroach-inspired hexapod robot: performance enhancement through dynamic simulation 205
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 194
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines. 155
An advanced multibody model for evaluating rider’s influence on motorcycle dynamics 146
An integrated approach to customize the packaging of heritage artefacts 142
Alternative elliptic integral solution to the beam deflection equations for the design of compliant mechanisms 141
An integrated approach to design an innovative motorcycle rear suspension with eccentric mechanism 141
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 140
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 135
Error control in UAV image acquisitions for 3D reconstruction of extensive architectures 130
A method for similarity assessment between death masks and portraits through linear projection: The case of Vincenzo Bellini 128
Interactive re-design of a novel variable geometry bicycle saddle to prevent neurological pathologies 127
An effective model for the sliding contact forces in a multibody environment 126
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines 124
Meshing angles evaluation of silent chain drive by numerical analysis and experimental test 122
An integrated approach to optimize solder joint reliability 122
An Integrated Approach for Shape Optimization with Mesh-Morphing 121
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 119
Flexible Multibody Model of Desmodromic Timing System 112
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 110
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 108
Advances on mechanics, design engineering and manufacturing 106
Dynamical modeling and design optimization of a cockroach-inspired hexapod 105
CFD Model for Thermal Impedance Evaluation of a SiC-Based Traction Inverter Considering Heat Coupling Effects 104
Un motoveicolo per diversamente abili 104
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 103
Development of a test machine for the tappet Characterization 101
Experimental methodology for the tappet characterization of timing system in I.C.E. 99
Structural and Topological Optimization in Robot Design 97
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 96
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 96
Dynamics of a high-performance motorcycle by an advanced multibody/control co-simulation 95
Tecniche di R.P. e R.E. applicate alla ricostruzione di reperti archeologici 93
Deep Learning Approach for the Future Advanced Driver Assistance Systems 92
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 92
UN KIT AUTOLIVELLANTE PER MACCHINE TREBBIATRICI 90
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 90
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 89
Characterization and simulation of four bending test to estimate resin-copper adhesion 88
Modified chain algorithm to study planar compliant mechanisms 84
SVILUPPO D I UNA METODOLOGIA PER LA MODELLAZIONE GEOMETRICA IN AMBIENTE MULTIBODY DI UN TENDITORE MECCANICO AD ALTA DEFORMABILITA' 83
A computer-based method to reproduce and analyse ancient series-produced moulded artefacts 83
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 80
Experimental characterization and modeling of power module warpage during assembly process 80
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 79
Redesign and multibody simulation of a motorcycle rear suspension with eccentric mechanism 79
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop 78
Virtual anthropology and rapid prototyping: A study of Vincenzo Bellini's death masks in relation to autopsy documentation 78
Geometric modeling and modal stress formulation for flexible multi-body dynamic analysis of crankshaft 78
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 77
GEOMETRIC AND MULTIBODY MODELING OF RIDER-MOTORCYCLE SYSTEM 75
Thermal measurement and numerical analysis for automotive power modules 72
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions 71
A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure 71
Mechanical characterization and modeling of different pad structures 69
OTTIMIZZAZIONE DELLE TOLLERANZE DI ACCOPPIAMENTO IN UN ASSE A CAMME CON BOCCIOLI RIPORTATI 68
Structural characterization of semiconductor multi-layer pad 66
The “Guerriero di Castiglione”: reconstructing missing elements with integrated non-destructive 3D modelling techniques 65
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 64
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 64
Experimental Reliability Assessment of ACEPACK SMIT Power Module 63
Silicon carbide die sintering layer: manufacturing process optimization and modeling 63
TIMs for transfer molded power modules: Characterization, reliability, and modeling 62
Ricostruzione tridimensionale del circolo cerebrale nel sistema stereotassico 61
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 61
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 58
Dynamic behaviour modelling of an internal combustion engine water pump transmission belt drive 57
Mechanical Characterization of Power Electronics Solder Materials 50
The reliability challenge of SiC Power Modules in Automotive Applications 49
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 49
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 48
Warpage modeling for semiconductor power module manufacturing flow improvement 37
Totale 6.810
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Categoria #
all - tutte 21.420
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 21.420
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/2021109 0 0 0 0 0 3 30 13 19 17 15 12
2021/2022399 31 47 5 6 57 13 65 14 27 10 9 115
2022/2023964 61 77 21 92 86 144 15 224 178 9 33 24
2023/2024427 14 87 17 50 16 80 4 14 8 18 77 42
2024/20251.511 43 213 68 86 320 226 37 50 119 114 135 100
2025/20262.914 236 243 913 284 518 720 0 0 0 0 0 0
Totale 6.810