IRIS
SEQUENZIA, GAETANO
 Distribuzione geografica
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Continente #
NA - Nord America 2.876
AS - Asia 963
EU - Europa 847
AF - Africa 300
SA - Sud America 187
OC - Oceania 1
Totale 5.174
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Nazione #
US - Stati Uniti d'America 2.821
SG - Singapore 442
IT - Italia 380
CN - Cina 379
IE - Irlanda 199
CI - Costa d'Avorio 175
BR - Brasile 158
SN - Senegal 106
UA - Ucraina 81
KR - Corea 49
RU - Federazione Russa 48
CA - Canada 45
DE - Germania 27
FI - Finlandia 19
GB - Regno Unito 18
PL - Polonia 16
HK - Hong Kong 14
IN - India 14
AR - Argentina 12
SE - Svezia 12
VN - Vietnam 12
FR - Francia 9
JP - Giappone 9
TW - Taiwan 8
ES - Italia 7
GR - Grecia 7
AT - Austria 6
BD - Bangladesh 6
NG - Nigeria 6
NL - Olanda 6
ZA - Sudafrica 6
EC - Ecuador 5
TR - Turchia 5
CH - Svizzera 4
CL - Cile 4
MX - Messico 4
AZ - Azerbaigian 3
IQ - Iraq 3
PS - Palestinian Territory 3
BE - Belgio 2
CO - Colombia 2
JM - Giamaica 2
KZ - Kazakistan 2
LB - Libano 2
LT - Lituania 2
MA - Marocco 2
MY - Malesia 2
PE - Perù 2
PH - Filippine 2
SA - Arabia Saudita 2
UY - Uruguay 2
UZ - Uzbekistan 2
AE - Emirati Arabi Uniti 1
AU - Australia 1
BG - Bulgaria 1
BS - Bahamas 1
DO - Repubblica Dominicana 1
DZ - Algeria 1
EE - Estonia 1
GN - Guinea 1
ID - Indonesia 1
JO - Giordania 1
KE - Kenya 1
MT - Malta 1
MU - Mauritius 1
NO - Norvegia 1
PA - Panama 1
PK - Pakistan 1
PR - Porto Rico 1
PY - Paraguay 1
VE - Venezuela 1
ZW - Zimbabwe 1
Totale 5.174
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Città #
Dallas 842
Santa Clara 472
Chandler 385
Singapore 283
Dublin 199
Abidjan 175
Hefei 121
Boardman 109
Chicago 106
Dakar 106
Jacksonville 100
Catania 76
Beijing 60
Ashburn 59
Lawrence 53
Cambridge 52
Civitanova Marche 52
Seoul 49
Andover 47
Los Angeles 40
Des Moines 30
Toronto 30
Nanjing 27
Wilmington 25
Council Bluffs 24
Milan 23
The Dalles 18
Columbus 17
Nanchang 17
Lappeenranta 15
Rome 13
Hong Kong 12
Falls Church 11
Hebei 11
Saint Petersburg 11
San Francisco 11
São Paulo 11
Tremestieri Etneo 11
Warsaw 11
Ottawa 10
San Mateo 10
Boston 9
Duncan 9
Brooklyn 8
Shenyang 8
Liberty Lake 7
Munich 7
New York 7
Scicli 7
Abuja 6
Bari 6
Seattle 6
Shanghai 6
Sortino 6
Barlassina 5
Mascali 5
Messina 5
Aci Catena 4
Changsha 4
Chennai 4
Gravina di Catania 4
Helsinki 4
Ho Chi Minh City 4
Houston 4
Jiaxing 4
Nicosia 4
Nova Iguaçu 4
Porto Alegre 4
Pune 4
Santa Margherita 4
Taipei 4
Tokyo 4
Avellino 3
Baghdad 3
Baku 3
Barueri 3
Bologna 3
Bra 3
Bremen 3
Carlentini 3
Cáceres 3
Denver 3
Dhaka 3
Esslingen am Neckar 3
Frankfurt am Main 3
Guangzhou 3
Johannesburg 3
Kocaeli 3
Kunming 3
Manduria 3
Montreal 3
Moscow 3
Nicolosi 3
Ningbo 3
Palermo 3
Pittsburgh 3
Secaucus 3
Tianjin 3
Yunlin 3
Aci Castello 2
Totale 3.984
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Nome #
A cockroach-inspired hexapod robot: performance enhancement through dynamic simulation 175
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 169
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines. 126
An integrated approach to customize the packaging of heritage artefacts 111
An integrated approach to design an innovative motorcycle rear suspension with eccentric mechanism 111
An advanced multibody model for evaluating rider’s influence on motorcycle dynamics 110
Alternative elliptic integral solution to the beam deflection equations for the design of compliant mechanisms 107
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 106
Flexible Multibody Model of Desmodromic Timing System 104
Error control in UAV image acquisitions for 3D reconstruction of extensive architectures 103
Interactive re-design of a novel variable geometry bicycle saddle to prevent neurological pathologies 98
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 97
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 97
An effective model for the sliding contact forces in a multibody environment 95
Meshing angles evaluation of silent chain drive by numerical analysis and experimental test 93
A method for similarity assessment between death masks and portraits through linear projection: The case of Vincenzo Bellini 92
An integrated approach to optimize solder joint reliability 91
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines 90
Experimental methodology for the tappet characterization of timing system in I.C.E. 90
An Integrated Approach for Shape Optimization with Mesh-Morphing 89
Dynamical modeling and design optimization of a cockroach-inspired hexapod 85
Tecniche di R.P. e R.E. applicate alla ricostruzione di reperti archeologici 84
Un motoveicolo per diversamente abili 84
Advances on mechanics, design engineering and manufacturing 82
Development of a test machine for the tappet Characterization 80
UN KIT AUTOLIVELLANTE PER MACCHINE TREBBIATRICI 79
Dynamics of a high-performance motorcycle by an advanced multibody/control co-simulation 78
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 78
Structural and Topological Optimization in Robot Design 75
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 75
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 74
Modified chain algorithm to study planar compliant mechanisms 73
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 73
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 72
SVILUPPO D I UNA METODOLOGIA PER LA MODELLAZIONE GEOMETRICA IN AMBIENTE MULTIBODY DI UN TENDITORE MECCANICO AD ALTA DEFORMABILITA' 71
Redesign and multibody simulation of a motorcycle rear suspension with eccentric mechanism 71
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 71
Deep Learning Approach for the Future Advanced Driver Assistance Systems 70
Virtual anthropology and rapid prototyping: A study of Vincenzo Bellini's death masks in relation to autopsy documentation 70
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 69
Geometric modeling and modal stress formulation for flexible multi-body dynamic analysis of crankshaft 67
CFD Model for Thermal Impedance Evaluation of a SiC-Based Traction Inverter Considering Heat Coupling Effects 66
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 66
GEOMETRIC AND MULTIBODY MODELING OF RIDER-MOTORCYCLE SYSTEM 65
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 65
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 63
Thermal measurement and numerical analysis for automotive power modules 63
A computer-based method to reproduce and analyse ancient series-produced moulded artefacts 63
OTTIMIZZAZIONE DELLE TOLLERANZE DI ACCOPPIAMENTO IN UN ASSE A CAMME CON BOCCIOLI RIPORTATI 61
Mechanical characterization and modeling of different pad structures 61
Structural characterization of semiconductor multi-layer pad 57
Silicon carbide die sintering layer: manufacturing process optimization and modeling 57
The “Guerriero di Castiglione”: reconstructing missing elements with integrated non-destructive 3D modelling techniques 56
Experimental characterization and modeling of power module warpage during assembly process 56
Characterization and simulation of four bending test to estimate resin-copper adhesion 54
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 54
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 52
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop 52
Ricostruzione tridimensionale del circolo cerebrale nel sistema stereotassico 52
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions 50
TIMs for transfer molded power modules: Characterization, reliability, and modeling 50
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 50
Dynamic behaviour modelling of an internal combustion engine water pump transmission belt drive 50
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 50
A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure 44
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 44
Mechanical Characterization of Power Electronics Solder Materials 44
Experimental Reliability Assessment of ACEPACK SMIT Power Module 43
The reliability challenge of SiC Power Modules in Automotive Applications 43
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 42
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 41
Warpage modeling for semiconductor power module manufacturing flow improvement 30
Totale 5.379
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Categoria #
all - tutte 19.077
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 19.077
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/2021159 0 0 0 0 50 3 30 13 19 17 15 12
2021/2022399 31 47 5 6 57 13 65 14 27 10 9 115
2022/2023964 61 77 21 92 86 144 15 224 178 9 33 24
2023/2024427 14 87 17 50 16 80 4 14 8 18 77 42
2024/20251.511 43 213 68 86 320 226 37 50 119 114 135 100
2025/20261.483 236 243 913 91 0 0 0 0 0 0 0 0
Totale 5.379