IRIS
SEQUENZIA, GAETANO
 Distribuzione geografica
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Continente #
NA - Nord America 3.677
AS - Asia 1.762
EU - Europa 1.731
AF - Africa 368
SA - Sud America 258
OC - Oceania 2
Totale 7.798
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Nazione #
US - Stati Uniti d'America 3.589
SG - Singapore 818
RU - Federazione Russa 684
CN - Cina 485
IT - Italia 441
BR - Brasile 200
IE - Irlanda 200
CI - Costa d'Avorio 176
VN - Vietnam 130
SN - Senegal 107
KR - Corea 90
UA - Ucraina 86
FR - Francia 79
CA - Canada 63
BD - Bangladesh 58
NG - Nigeria 47
NL - Olanda 43
GB - Regno Unito 41
DE - Germania 40
IN - India 33
PL - Polonia 30
AR - Argentina 28
HK - Hong Kong 27
JP - Giappone 23
FI - Finlandia 22
SE - Svezia 19
ZA - Sudafrica 14
ES - Italia 13
IQ - Iraq 13
MX - Messico 13
TR - Turchia 13
TW - Taiwan 12
GR - Grecia 8
ID - Indonesia 8
PK - Pakistan 8
EC - Ecuador 7
AT - Austria 6
CL - Cile 6
KE - Kenya 6
SA - Arabia Saudita 6
CO - Colombia 5
MY - Malesia 5
BJ - Benin 4
CH - Svizzera 4
IR - Iran 4
JM - Giamaica 4
KZ - Kazakistan 4
MA - Marocco 4
UY - Uruguay 4
UZ - Uzbekistan 4
AZ - Azerbaigian 3
BE - Belgio 3
JO - Giordania 3
LT - Lituania 3
PE - Perù 3
PH - Filippine 3
PS - Palestinian Territory 3
TN - Tunisia 3
VE - Venezuela 3
AE - Emirati Arabi Uniti 2
AU - Australia 2
DO - Repubblica Dominicana 2
LB - Libano 2
PA - Panama 2
AL - Albania 1
BG - Bulgaria 1
BO - Bolivia 1
BS - Bahamas 1
CR - Costa Rica 1
CZ - Repubblica Ceca 1
DZ - Algeria 1
EE - Estonia 1
EG - Egitto 1
ET - Etiopia 1
GA - Gabon 1
GE - Georgia 1
GN - Guinea 1
HU - Ungheria 1
IL - Israele 1
KW - Kuwait 1
LK - Sri Lanka 1
MT - Malta 1
MU - Mauritius 1
NO - Norvegia 1
PR - Porto Rico 1
PT - Portogallo 1
PY - Paraguay 1
SK - Slovacchia (Repubblica Slovacca) 1
TH - Thailandia 1
TT - Trinidad e Tobago 1
ZW - Zimbabwe 1
Totale 7.798
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Città #
Dallas 848
Singapore 501
Santa Clara 480
Chandler 386
Moscow 297
San Jose 294
Dublin 200
Abidjan 176
Ashburn 173
Hefei 121
Chicago 110
Boardman 109
Dakar 107
Jacksonville 100
Seoul 89
Beijing 86
Los Angeles 81
Catania 77
Lauterbourg 62
Lawrence 53
Cambridge 52
Civitanova Marche 52
Andover 47
Council Bluffs 42
Ho Chi Minh City 41
Amsterdam 37
New York 35
Toronto 33
Des Moines 30
Hanoi 30
Nanjing 27
Hong Kong 25
Milan 25
Wilmington 25
Buffalo 24
Lagos 24
Warsaw 24
Rome 21
Abuja 19
Orem 18
The Dalles 18
Columbus 17
Nanchang 17
Tokyo 17
São Paulo 16
Denver 15
Frankfurt am Main 15
Lappeenranta 15
Boston 14
Brooklyn 13
San Francisco 13
Houston 12
Falls Church 11
Hebei 11
Saint Petersburg 11
Tremestieri Etneo 11
Montreal 10
Ottawa 10
Poplar 10
San Mateo 10
Bologna 9
Chennai 9
Duncan 9
Seattle 9
Atlanta 8
Johannesburg 8
Messina 8
Shanghai 8
Shenyang 8
Helsinki 7
Liberty Lake 7
Manchester 7
Munich 7
Scicli 7
Stockholm 7
Bari 6
Da Nang 6
London 6
Mexico City 6
New Delhi 6
Paris 6
Sortino 6
Baghdad 5
Barlassina 5
Dhaka 5
Florence 5
Mascali 5
Nairobi 5
Naples 5
Phoenix 5
Porto Alegre 5
Aci Catena 4
Ankara 4
Belpasso 4
Bắc Giang 4
Changsha 4
Cotonou 4
Gravina di Catania 4
Hải Dương 4
Jiaxing 4
Totale 5.488
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Nome #
A cockroach-inspired hexapod robot: performance enhancement through dynamic simulation 223
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 213
An advanced multibody model for evaluating rider’s influence on motorcycle dynamics 173
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines. 167
An integrated approach to customize the packaging of heritage artefacts 166
Alternative elliptic integral solution to the beam deflection equations for the design of compliant mechanisms 161
An integrated approach to design an innovative motorcycle rear suspension with eccentric mechanism 158
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 157
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 156
A method for similarity assessment between death masks and portraits through linear projection: The case of Vincenzo Bellini 150
An effective model for the sliding contact forces in a multibody environment 143
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines 142
Interactive re-design of a novel variable geometry bicycle saddle to prevent neurological pathologies 141
Error control in UAV image acquisitions for 3D reconstruction of extensive architectures 140
Meshing angles evaluation of silent chain drive by numerical analysis and experimental test 140
An integrated approach to optimize solder joint reliability 140
An Integrated Approach for Shape Optimization with Mesh-Morphing 138
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 134
CFD Model for Thermal Impedance Evaluation of a SiC-Based Traction Inverter Considering Heat Coupling Effects 130
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 130
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 130
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 125
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 123
Dynamical modeling and design optimization of a cockroach-inspired hexapod 122
Development of a test machine for the tappet Characterization 122
Dynamics of a high-performance motorcycle by an advanced multibody/control co-simulation 122
Advances on mechanics, design engineering and manufacturing 120
Flexible Multibody Model of Desmodromic Timing System 120
Un motoveicolo per diversamente abili 120
Experimental methodology for the tappet characterization of timing system in I.C.E. 113
Deep Learning Approach for the Future Advanced Driver Assistance Systems 112
Structural and Topological Optimization in Robot Design 112
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 108
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 107
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 106
Tecniche di R.P. e R.E. applicate alla ricostruzione di reperti archeologici 105
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 104
Characterization and simulation of four bending test to estimate resin-copper adhesion 103
UN KIT AUTOLIVELLANTE PER MACCHINE TREBBIATRICI 99
A computer-based method to reproduce and analyse ancient series-produced moulded artefacts 99
SVILUPPO D I UNA METODOLOGIA PER LA MODELLAZIONE GEOMETRICA IN AMBIENTE MULTIBODY DI UN TENDITORE MECCANICO AD ALTA DEFORMABILITA' 96
Experimental characterization and modeling of power module warpage during assembly process 96
Geometric modeling and modal stress formulation for flexible multi-body dynamic analysis of crankshaft 95
A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure 94
Modified chain algorithm to study planar compliant mechanisms 94
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 94
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions 89
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop 88
Thermal measurement and numerical analysis for automotive power modules 87
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 87
Redesign and multibody simulation of a motorcycle rear suspension with eccentric mechanism 87
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 86
Virtual anthropology and rapid prototyping: A study of Vincenzo Bellini's death masks in relation to autopsy documentation 85
GEOMETRIC AND MULTIBODY MODELING OF RIDER-MOTORCYCLE SYSTEM 84
OTTIMIZZAZIONE DELLE TOLLERANZE DI ACCOPPIAMENTO IN UN ASSE A CAMME CON BOCCIOLI RIPORTATI 80
Structural characterization of semiconductor multi-layer pad 80
Experimental Reliability Assessment of ACEPACK SMIT Power Module 79
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 78
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 77
Mechanical characterization and modeling of different pad structures 76
TIMs for transfer molded power modules: Characterization, reliability, and modeling 74
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 74
Ricostruzione tridimensionale del circolo cerebrale nel sistema stereotassico 72
Silicon carbide die sintering layer: manufacturing process optimization and modeling 72
The “Guerriero di Castiglione”: reconstructing missing elements with integrated non-destructive 3D modelling techniques 70
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 67
Mechanical Characterization of Power Electronics Solder Materials 64
Dynamic behaviour modelling of an internal combustion engine water pump transmission belt drive 63
The reliability challenge of SiC Power Modules in Automotive Applications 61
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 58
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 56
Warpage modeling for semiconductor power module manufacturing flow improvement 49
Dynamic Gate Stress: Impact of duty cycle and gate resistance on automotive grade planar-gate 1200 V SiC MOSFET 39
NURBS-Based Surrogate Model for Fast and High-Fidelity Predictions of Pressure Drop and Pin-Fins Temperature in Traction Inverter 29
Optimization of pin-fin arrangement in traction inverter cooling systems: A framework based on CFD simulations, deep neural networks and evolutionary algorithms 28
Damping Properties Evaluation of Viscoelastic Lattice Structures 15
Modified chain algorithm to study planar compliant mechanisms 7
Electrical Wafer Sorting: a Deep Learning Approach for Advanced Wafer Defect Map Evaluation 3
Determination of the effective elastic and damping properties of polymer lattice structures 3
Totale 8.010
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Categoria #
all - tutte 25.109
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 25.109
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202112 0 0 0 0 0 0 0 0 0 0 0 12
2021/2022399 31 47 5 6 57 13 65 14 27 10 9 115
2022/2023964 61 77 21 92 86 144 15 224 178 9 33 24
2023/2024427 14 87 17 50 16 80 4 14 8 18 77 42
2024/20251.511 43 213 68 86 320 226 37 50 119 114 135 100
2025/20264.114 236 243 913 284 518 811 344 58 226 235 78 168
Totale 8.010