IRIS
SEQUENZIA, GAETANO
 Distribuzione geografica
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Continente #
NA - Nord America 3.523
EU - Europa 1.697
AS - Asia 1.695
AF - Africa 368
SA - Sud America 258
OC - Oceania 2
Totale 7.543
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Nazione #
US - Stati Uniti d'America 3.444
SG - Singapore 808
RU - Federazione Russa 684
CN - Cina 473
IT - Italia 409
BR - Brasile 200
IE - Irlanda 200
CI - Costa d'Avorio 176
VN - Vietnam 130
SN - Senegal 107
KR - Corea 90
UA - Ucraina 86
FR - Francia 79
CA - Canada 56
NG - Nigeria 47
NL - Olanda 43
DE - Germania 40
GB - Regno Unito 40
IN - India 32
PL - Polonia 30
AR - Argentina 28
HK - Hong Kong 25
FI - Finlandia 22
JP - Giappone 22
BD - Bangladesh 19
SE - Svezia 19
ZA - Sudafrica 14
ES - Italia 13
IQ - Iraq 13
TR - Turchia 13
MX - Messico 12
TW - Taiwan 10
GR - Grecia 8
ID - Indonesia 8
PK - Pakistan 8
EC - Ecuador 7
AT - Austria 6
CL - Cile 6
KE - Kenya 6
SA - Arabia Saudita 6
CO - Colombia 5
MY - Malesia 5
BJ - Benin 4
CH - Svizzera 4
IR - Iran 4
JM - Giamaica 4
KZ - Kazakistan 4
MA - Marocco 4
UY - Uruguay 4
UZ - Uzbekistan 4
AZ - Azerbaigian 3
BE - Belgio 3
JO - Giordania 3
LT - Lituania 3
PE - Perù 3
PH - Filippine 3
PS - Palestinian Territory 3
TN - Tunisia 3
VE - Venezuela 3
AE - Emirati Arabi Uniti 2
AU - Australia 2
DO - Repubblica Dominicana 2
LB - Libano 2
PA - Panama 2
AL - Albania 1
BG - Bulgaria 1
BO - Bolivia 1
BS - Bahamas 1
CR - Costa Rica 1
CZ - Repubblica Ceca 1
DZ - Algeria 1
EE - Estonia 1
EG - Egitto 1
ET - Etiopia 1
GA - Gabon 1
GE - Georgia 1
GN - Guinea 1
HU - Ungheria 1
IL - Israele 1
KW - Kuwait 1
LK - Sri Lanka 1
MT - Malta 1
MU - Mauritius 1
NO - Norvegia 1
PR - Porto Rico 1
PT - Portogallo 1
PY - Paraguay 1
TH - Thailandia 1
ZW - Zimbabwe 1
Totale 7.543
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Città #
Dallas 846
Singapore 501
Santa Clara 479
Chandler 386
Moscow 297
San Jose 208
Dublin 200
Abidjan 176
Ashburn 166
Hefei 121
Boardman 109
Chicago 108
Dakar 107
Jacksonville 100
Seoul 89
Beijing 85
Los Angeles 80
Catania 77
Lauterbourg 62
Lawrence 53
Cambridge 52
Civitanova Marche 52
Andover 47
Council Bluffs 42
Ho Chi Minh City 41
Amsterdam 37
New York 33
Toronto 32
Des Moines 30
Hanoi 30
Nanjing 27
Milan 25
Wilmington 25
Lagos 24
Warsaw 24
Hong Kong 23
Abuja 19
The Dalles 18
Buffalo 17
Columbus 17
Nanchang 17
Tokyo 17
Orem 16
São Paulo 16
Denver 15
Frankfurt am Main 15
Lappeenranta 15
Boston 14
Rome 14
San Francisco 13
Houston 12
Brooklyn 11
Falls Church 11
Hebei 11
Saint Petersburg 11
Tremestieri Etneo 11
Ottawa 10
Poplar 10
San Mateo 10
Chennai 9
Duncan 9
Montreal 9
Seattle 9
Johannesburg 8
Messina 8
Shenyang 8
Atlanta 7
Bologna 7
Helsinki 7
Liberty Lake 7
Manchester 7
Munich 7
Scicli 7
Shanghai 7
Stockholm 7
Bari 6
Da Nang 6
New Delhi 6
Paris 6
Sortino 6
Baghdad 5
Barlassina 5
Dhaka 5
London 5
Mascali 5
Mexico City 5
Nairobi 5
Phoenix 5
Porto Alegre 5
Aci Catena 4
Ankara 4
Belpasso 4
Bắc Giang 4
Changsha 4
Cotonou 4
Florence 4
Gravina di Catania 4
Hải Dương 4
Jiaxing 4
Montevideo 4
Totale 5.356
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Nome #
A cockroach-inspired hexapod robot: performance enhancement through dynamic simulation 219
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 210
An advanced multibody model for evaluating rider’s influence on motorcycle dynamics 171
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines. 166
An integrated approach to customize the packaging of heritage artefacts 163
Alternative elliptic integral solution to the beam deflection equations for the design of compliant mechanisms 160
An integrated approach to design an innovative motorcycle rear suspension with eccentric mechanism 157
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 155
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 154
A method for similarity assessment between death masks and portraits through linear projection: The case of Vincenzo Bellini 149
An effective model for the sliding contact forces in a multibody environment 142
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines 139
An integrated approach to optimize solder joint reliability 138
Interactive re-design of a novel variable geometry bicycle saddle to prevent neurological pathologies 137
Error control in UAV image acquisitions for 3D reconstruction of extensive architectures 137
Meshing angles evaluation of silent chain drive by numerical analysis and experimental test 136
An Integrated Approach for Shape Optimization with Mesh-Morphing 135
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 132
CFD Model for Thermal Impedance Evaluation of a SiC-Based Traction Inverter Considering Heat Coupling Effects 127
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 124
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 121
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 120
Dynamical modeling and design optimization of a cockroach-inspired hexapod 120
Development of a test machine for the tappet Characterization 120
Advances on mechanics, design engineering and manufacturing 118
Flexible Multibody Model of Desmodromic Timing System 118
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 116
Un motoveicolo per diversamente abili 116
Dynamics of a high-performance motorcycle by an advanced multibody/control co-simulation 115
Structural and Topological Optimization in Robot Design 111
Experimental methodology for the tappet characterization of timing system in I.C.E. 110
Deep Learning Approach for the Future Advanced Driver Assistance Systems 107
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 106
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 106
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 104
Tecniche di R.P. e R.E. applicate alla ricostruzione di reperti archeologici 104
Characterization and simulation of four bending test to estimate resin-copper adhesion 102
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 101
UN KIT AUTOLIVELLANTE PER MACCHINE TREBBIATRICI 98
A computer-based method to reproduce and analyse ancient series-produced moulded artefacts 98
A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure 94
SVILUPPO D I UNA METODOLOGIA PER LA MODELLAZIONE GEOMETRICA IN AMBIENTE MULTIBODY DI UN TENDITORE MECCANICO AD ALTA DEFORMABILITA' 94
Experimental characterization and modeling of power module warpage during assembly process 94
Modified chain algorithm to study planar compliant mechanisms 93
Geometric modeling and modal stress formulation for flexible multi-body dynamic analysis of crankshaft 93
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 90
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 86
Redesign and multibody simulation of a motorcycle rear suspension with eccentric mechanism 86
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions 85
Thermal measurement and numerical analysis for automotive power modules 85
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop 84
Virtual anthropology and rapid prototyping: A study of Vincenzo Bellini's death masks in relation to autopsy documentation 84
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 84
GEOMETRIC AND MULTIBODY MODELING OF RIDER-MOTORCYCLE SYSTEM 83
OTTIMIZZAZIONE DELLE TOLLERANZE DI ACCOPPIAMENTO IN UN ASSE A CAMME CON BOCCIOLI RIPORTATI 78
Structural characterization of semiconductor multi-layer pad 78
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 77
Experimental Reliability Assessment of ACEPACK SMIT Power Module 77
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 75
Mechanical characterization and modeling of different pad structures 75
TIMs for transfer molded power modules: Characterization, reliability, and modeling 74
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 71
Ricostruzione tridimensionale del circolo cerebrale nel sistema stereotassico 70
The “Guerriero di Castiglione”: reconstructing missing elements with integrated non-destructive 3D modelling techniques 69
Silicon carbide die sintering layer: manufacturing process optimization and modeling 69
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 64
Mechanical Characterization of Power Electronics Solder Materials 63
The reliability challenge of SiC Power Modules in Automotive Applications 60
Dynamic behaviour modelling of an internal combustion engine water pump transmission belt drive 60
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 55
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 55
Warpage modeling for semiconductor power module manufacturing flow improvement 44
Optimization of pin-fin arrangement in traction inverter cooling systems: A framework based on CFD simulations, deep neural networks and evolutionary algorithms 21
NURBS-Based Surrogate Model for Fast and High-Fidelity Predictions of Pressure Drop and Pin-Fins Temperature in Traction Inverter 6
Modified chain algorithm to study planar compliant mechanisms 6
Electrical Wafer Sorting: a Deep Learning Approach for Advanced Wafer Defect Map Evaluation 3
Dynamic Gate Stress: Impact of duty cycle and gate resistance on automotive grade planar-gate 1200 V SiC MOSFET 3
Determination of the effective elastic and damping properties of polymer lattice structures 3
Damping Properties Evaluation of Viscoelastic Lattice Structures 2
Totale 7.755
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Categoria #
all - tutte 23.314
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 23.314
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202144 0 0 0 0 0 0 0 0 0 17 15 12
2021/2022399 31 47 5 6 57 13 65 14 27 10 9 115
2022/2023964 61 77 21 92 86 144 15 224 178 9 33 24
2023/2024427 14 87 17 50 16 80 4 14 8 18 77 42
2024/20251.511 43 213 68 86 320 226 37 50 119 114 135 100
2025/20263.859 236 243 913 284 518 811 344 58 226 226 0 0
Totale 7.755