IRIS
SEQUENZIA, GAETANO
 Distribuzione geografica
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Continente #
NA - Nord America 1.997
AS - Asia 856
EU - Europa 815
AF - Africa 225
SA - Sud America 136
OC - Oceania 1
Totale 4.030
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Nazione #
US - Stati Uniti d'America 1.943
SG - Singapore 434
IT - Italia 365
CN - Cina 324
IE - Irlanda 199
BR - Brasile 123
CI - Costa d'Avorio 107
SN - Senegal 106
UA - Ucraina 79
RU - Federazione Russa 47
CA - Canada 44
KR - Corea 37
DE - Germania 26
FI - Finlandia 16
PL - Polonia 13
GB - Regno Unito 12
SE - Svezia 12
IN - India 11
FR - Francia 9
JP - Giappone 8
TW - Taiwan 8
ES - Italia 7
GR - Grecia 7
AR - Argentina 6
AT - Austria 6
NG - Nigeria 6
NL - Olanda 6
BD - Bangladesh 5
TR - Turchia 5
CH - Svizzera 4
HK - Hong Kong 4
MX - Messico 4
ZA - Sudafrica 4
PS - Palestinian Territory 3
AZ - Azerbaigian 2
BE - Belgio 2
IQ - Iraq 2
JM - Giamaica 2
LB - Libano 2
LT - Lituania 2
MA - Marocco 2
PE - Perù 2
PH - Filippine 2
SA - Arabia Saudita 2
VN - Vietnam 2
AU - Australia 1
BG - Bulgaria 1
BS - Bahamas 1
CL - Cile 1
CO - Colombia 1
DO - Repubblica Dominicana 1
EE - Estonia 1
JO - Giordania 1
KZ - Kazakistan 1
MT - Malta 1
MY - Malesia 1
PA - Panama 1
PK - Pakistan 1
PR - Porto Rico 1
PY - Paraguay 1
UY - Uruguay 1
UZ - Uzbekistan 1
VE - Venezuela 1
Totale 4.030
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Città #
Santa Clara 469
Chandler 385
Singapore 282
Dublin 199
Boardman 109
Abidjan 107
Chicago 106
Dakar 106
Jacksonville 99
Hefei 86
Catania 71
Beijing 59
Ashburn 54
Lawrence 53
Cambridge 52
Civitanova Marche 52
Andover 47
Seoul 37
Des Moines 30
Toronto 30
Nanjing 27
Wilmington 25
Council Bluffs 24
Los Angeles 23
Milan 22
The Dalles 18
Columbus 17
Nanchang 17
Lappeenranta 12
Falls Church 11
Hebei 11
Rome 11
Saint Petersburg 11
San Francisco 11
Ottawa 10
San Mateo 10
Tremestieri Etneo 10
Boston 9
Duncan 9
Shenyang 8
Warsaw 8
Brooklyn 7
Liberty Lake 7
Munich 7
Scicli 7
Abuja 6
Bari 6
New York 6
Seattle 6
Shanghai 6
Sortino 6
São Paulo 6
Barlassina 5
Mascali 5
Messina 5
Aci Catena 4
Changsha 4
Gravina di Catania 4
Helsinki 4
Houston 4
Jiaxing 4
Nicosia 4
Nova Iguaçu 4
Pune 4
Santa Margherita 4
Taipei 4
Tokyo 4
Avellino 3
Bologna 3
Bra 3
Bremen 3
Carlentini 3
Chennai 3
Cáceres 3
Dhaka 3
Esslingen am Neckar 3
Guangzhou 3
Kocaeli 3
Kunming 3
Manduria 3
Montreal 3
Moscow 3
Nicolosi 3
Ningbo 3
Palermo 3
Porto Alegre 3
Secaucus 3
Tianjin 3
Yunlin 3
Arnhem 2
Baghdad 2
Baku 2
Betim 2
Brescia 2
Central 2
Charlotte 2
Columbia 2
Contagem 2
Crato 2
Dallas 2
Totale 2.958
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Nome #
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines. 107
A cockroach-inspired hexapod robot: performance enhancement through dynamic simulation 104
An advanced multibody model for evaluating rider’s influence on motorcycle dynamics 93
Error control in UAV image acquisitions for 3D reconstruction of extensive architectures 92
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 91
Flexible Multibody Model of Desmodromic Timing System 90
Interactive re-design of a novel variable geometry bicycle saddle to prevent neurological pathologies 87
An integrated approach to customize the packaging of heritage artefacts 87
An effective model for the sliding contact forces in a multibody environment 86
Meshing angles evaluation of silent chain drive by numerical analysis and experimental test 84
Alternative elliptic integral solution to the beam deflection equations for the design of compliant mechanisms 83
Experimental methodology for the tappet characterization of timing system in I.C.E. 82
An Integrated Approach for Shape Optimization with Mesh-Morphing 80
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 79
A new methodology for calculating and modelling non-linear springs in the valve train of internal combustion engines 77
Un motoveicolo per diversamente abili 75
Dynamical modeling and design optimization of a cockroach-inspired hexapod 74
UN KIT AUTOLIVELLANTE PER MACCHINE TREBBIATRICI 73
Development of a test machine for the tappet Characterization 73
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 73
A method for similarity assessment between death masks and portraits through linear projection: The case of Vincenzo Bellini 73
Tecniche di R.P. e R.E. applicate alla ricostruzione di reperti archeologici 72
An integrated approach to design an innovative motorcycle rear suspension with eccentric mechanism 72
Advances on mechanics, design engineering and manufacturing 70
An integrated approach to optimize solder joint reliability 68
SVILUPPO D I UNA METODOLOGIA PER LA MODELLAZIONE GEOMETRICA IN AMBIENTE MULTIBODY DI UN TENDITORE MECCANICO AD ALTA DEFORMABILITA' 64
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 64
Redesign and multibody simulation of a motorcycle rear suspension with eccentric mechanism 64
Modified chain algorithm to study planar compliant mechanisms 63
Dynamics of a high-performance motorcycle by an advanced multibody/control co-simulation 63
Structural and Topological Optimization in Robot Design 62
Virtual anthropology and rapid prototyping: A study of Vincenzo Bellini's death masks in relation to autopsy documentation 61
GEOMETRIC AND MULTIBODY MODELING OF RIDER-MOTORCYCLE SYSTEM 61
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 61
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 60
Geometric modeling and modal stress formulation for flexible multi-body dynamic analysis of crankshaft 56
Thermal measurement and numerical analysis for automotive power modules 55
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 55
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 54
OTTIMIZZAZIONE DELLE TOLLERANZE DI ACCOPPIAMENTO IN UN ASSE A CAMME CON BOCCIOLI RIPORTATI 54
Structural characterization of semiconductor multi-layer pad 53
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 52
Mechanical characterization and modeling of different pad structures 51
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 51
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 50
A computer-based method to reproduce and analyse ancient series-produced moulded artefacts 50
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 49
Silicon carbide die sintering layer: manufacturing process optimization and modeling 49
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 47
Ricostruzione tridimensionale del circolo cerebrale nel sistema stereotassico 46
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 46
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 45
The “Guerriero di Castiglione”: reconstructing missing elements with integrated non-destructive 3D modelling techniques 45
Experimental characterization and modeling of power module warpage during assembly process 45
Dynamic behaviour modelling of an internal combustion engine water pump transmission belt drive 45
CFD Model for Thermal Impedance Evaluation of a SiC-Based Traction Inverter Considering Heat Coupling Effects 42
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop 42
TIMs for transfer molded power modules: Characterization, reliability, and modeling 42
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 41
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions 40
Mechanical Characterization of Power Electronics Solder Materials 40
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 40
Characterization and simulation of four bending test to estimate resin-copper adhesion 38
The reliability challenge of SiC Power Modules in Automotive Applications 34
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 34
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 33
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 33
Deep Learning Approach for the Future Advanced Driver Assistance Systems 32
Experimental Reliability Assessment of ACEPACK SMIT Power Module 26
Warpage modeling for semiconductor power module manufacturing flow improvement 26
A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure 25
Totale 4.234
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Categoria #
all - tutte 16.663
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 16.663
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/2021193 0 10 24 0 50 3 30 13 19 17 15 12
2021/2022399 31 47 5 6 57 13 65 14 27 10 9 115
2022/2023964 61 77 21 92 86 144 15 224 178 9 33 24
2023/2024427 14 87 17 50 16 80 4 14 8 18 77 42
2024/20251.511 43 213 68 86 320 226 37 50 119 114 135 100
2025/2026338 236 102 0 0 0 0 0 0 0 0 0 0
Totale 4.234