INDELLI, Giuseppe Francesco
 Distribuzione geografica
Continente #
NA - Nord America 344
AS - Asia 195
EU - Europa 139
SA - Sud America 21
AF - Africa 19
Totale 718
Nazione #
US - Stati Uniti d'America 336
SG - Singapore 87
RU - Federazione Russa 57
CN - Cina 56
IE - Irlanda 25
KR - Corea 20
IT - Italia 19
BR - Brasile 17
VN - Vietnam 13
FR - Francia 12
DE - Germania 9
SN - Senegal 7
CI - Costa d'Avorio 6
GB - Regno Unito 5
HK - Hong Kong 5
CA - Canada 4
AR - Argentina 3
FI - Finlandia 3
IN - India 3
MX - Messico 3
BD - Bangladesh 2
ES - Italia 2
ID - Indonesia 2
KE - Kenya 2
NG - Nigeria 2
PL - Polonia 2
SE - Svezia 2
UA - Ucraina 2
BJ - Benin 1
ET - Etiopia 1
IL - Israele 1
IQ - Iraq 1
IR - Iran 1
JM - Giamaica 1
JP - Giappone 1
KG - Kirghizistan 1
LB - Libano 1
NL - Olanda 1
UY - Uruguay 1
UZ - Uzbekistan 1
Totale 718
Città #
Chandler 64
Singapore 53
Dallas 50
Ashburn 41
Santa Clara 37
Moscow 31
Hefei 30
San Jose 27
Dublin 25
Seoul 20
Chicago 16
Boardman 11
Centuripe 11
Beijing 10
Los Angeles 10
Bremen 7
Dakar 7
Abidjan 6
Lauterbourg 6
Marseille 6
Council Bluffs 4
Hanoi 4
Orem 4
Buffalo 3
Ho Chi Minh City 3
Hong Kong 3
Houston 3
Brooklyn 2
Charlotte 2
Jakarta 2
Lecce 2
Manfredonia 2
Nairobi 2
Poplar 2
Querétaro 2
Stockholm 2
Turku 2
Warsaw 2
Washington 2
Abuja 1
Arezzo 1
Berlin 1
Betim 1
Bishkek 1
Biên Hòa 1
Boston 1
Brasília 1
Browns Town 1
Cabreúva 1
Catania 1
Chennai 1
Columbus 1
Coromandel 1
Cotonou 1
Criciúma 1
Córdoba 1
Dardanelle 1
Denver 1
Elk Grove Village 1
Goshen 1
Granby 1
Guarulhos 1
Haiphong 1
Helena 1
Imbituba 1
Itapira 1
Lafayette 1
Lagos 1
London 1
Manchester 1
Mariana 1
Mason 1
Mek'ele 1
Mexico City 1
Montevideo 1
Montreal 1
Morpará 1
Munich 1
Nagercoil 1
New York 1
Ninh Bình 1
Oklahoma City 1
Palhoça 1
Peoria 1
Phoenix 1
Phủ Lý 1
Recife 1
Samarkand 1
San Francisco 1
San Rafael 1
Santa Bárbara d'Oeste 1
Sidon 1
Sinop 1
Sulaymaniyah 1
São José dos Campos 1
São Paulo 1
Tehran 1
The Dalles 1
Thomasville 1
Tokyo 1
Totale 577
Nome #
Materials science challenges in green high power density devices 1. The Ag loaded glues for die bonding. 118
Surface effects on the growth of solution processed pentacene thin films 113
Tantalum nitride thin film resistors by low temperature reactive sputtering for plastic electronics 107
Study of adhesion of molding compounds on differently treated copper surfaces 106
Patterned metallizations in perfluorosulphonate membranes by printing methods 104
Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics 99
Molding Compounds Adhesion and Influence on Reliability of Plastic Packages for SiC-Based Power MOS Devices 71
Totale 718
Categoria #
all - tutte 2.425
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 2.425


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2022/2023134 0 33 3 23 18 12 6 16 19 2 2 0
2023/202451 3 2 4 4 8 13 2 7 0 1 3 4
2024/2025143 7 25 4 0 31 16 3 0 8 14 15 20
2025/2026390 29 51 58 31 69 67 34 6 8 25 8 4
Totale 718