INDELLI, Giuseppe Francesco
 Distribuzione geografica
Continente #
NA - Nord America 111
EU - Europa 55
AF - Africa 11
AS - Asia 1
Totale 178
Nazione #
US - Stati Uniti d'America 111
IE - Irlanda 25
IT - Italia 16
DE - Germania 7
SN - Senegal 7
FR - Francia 6
CI - Costa d'Avorio 4
SG - Singapore 1
UA - Ucraina 1
Totale 178
Città #
Chandler 64
Dublin 25
Ashburn 23
Centuripe 11
Bremen 7
Dakar 7
Marseille 6
Abidjan 4
Boardman 4
Lecce 2
Washington 2
Arezzo 1
Catania 1
Singapore 1
Totale 158
Nome #
Materials science challenges in green high power density devices 1. The Ag loaded glues for die bonding. 31
Study of adhesion of molding compounds on differently treated copper surfaces 31
Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics 26
Patterned metallizations in perfluorosulphonate membranes by printing methods 25
Tantalum nitride thin film resistors by low temperature reactive sputtering for plastic electronics 24
Surface effects on the growth of solution processed pentacene thin films 22
Molding Compounds Adhesion and Influence on Reliability of Plastic Packages for SiC-Based Power MOS Devices 19
Totale 178
Categoria #
all - tutte 720
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 720


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2022/2023134 0 33 3 23 18 12 6 16 19 2 2 0
2023/202444 3 2 4 4 8 13 2 7 0 1 0 0
Totale 178