INDELLI, Giuseppe Francesco
 Distribuzione geografica
Continente #
NA - Nord America 290
AS - Asia 172
EU - Europa 76
AF - Africa 14
SA - Sud America 14
Totale 566
Nazione #
US - Stati Uniti d'America 285
SG - Singapore 85
CN - Cina 54
IE - Irlanda 25
IT - Italia 18
KR - Corea 18
BR - Brasile 12
DE - Germania 8
SN - Senegal 7
CI - Costa d'Avorio 6
FR - Francia 6
RU - Federazione Russa 6
GB - Regno Unito 4
VN - Vietnam 4
FI - Finlandia 3
MX - Messico 3
CA - Canada 2
HK - Hong Kong 2
IN - India 2
UA - Ucraina 2
AR - Argentina 1
BD - Bangladesh 1
BJ - Benin 1
ES - Italia 1
ID - Indonesia 1
IL - Israele 1
IQ - Iraq 1
IR - Iran 1
JP - Giappone 1
LB - Libano 1
NL - Olanda 1
PL - Polonia 1
SE - Svezia 1
UY - Uruguay 1
Totale 566
Città #
Chandler 64
Singapore 52
Dallas 50
Santa Clara 36
Ashburn 32
Hefei 30
Dublin 25
Seoul 18
Chicago 16
Boardman 11
Centuripe 11
Beijing 9
Los Angeles 9
Bremen 7
Dakar 7
Abidjan 6
Marseille 6
Moscow 4
Buffalo 3
Houston 3
Brooklyn 2
Charlotte 2
Council Bluffs 2
Hong Kong 2
Lecce 2
Manfredonia 2
Orem 2
Poplar 2
Querétaro 2
Turku 2
Washington 2
Arezzo 1
Betim 1
Biên Hòa 1
Boston 1
Brasília 1
Cabreúva 1
Catania 1
Chennai 1
Columbus 1
Coromandel 1
Cotonou 1
Denver 1
Elk Grove Village 1
Guarulhos 1
Hanoi 1
Helena 1
Ho Chi Minh City 1
Itapira 1
Jakarta 1
Manchester 1
Mariana 1
Mason 1
Mexico City 1
Montevideo 1
Montreal 1
Morpará 1
Munich 1
Ninh Bình 1
Oklahoma City 1
Phoenix 1
Recife 1
San Rafael 1
Santa Bárbara d'Oeste 1
Sidon 1
Sinop 1
Stockholm 1
Sulaymaniyah 1
São José dos Campos 1
Tehran 1
The Dalles 1
Tokyo 1
Topeka 1
Vancouver 1
Warsaw 1
Totale 465
Nome #
Materials science challenges in green high power density devices 1. The Ag loaded glues for die bonding. 96
Surface effects on the growth of solution processed pentacene thin films 91
Study of adhesion of molding compounds on differently treated copper surfaces 88
Patterned metallizations in perfluorosulphonate membranes by printing methods 82
Tantalum nitride thin film resistors by low temperature reactive sputtering for plastic electronics 81
Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics 74
Molding Compounds Adhesion and Influence on Reliability of Plastic Packages for SiC-Based Power MOS Devices 54
Totale 566
Categoria #
all - tutte 2.011
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 2.011


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2022/2023134 0 33 3 23 18 12 6 16 19 2 2 0
2023/202451 3 2 4 4 8 13 2 7 0 1 3 4
2024/2025143 7 25 4 0 31 16 3 0 8 14 15 20
2025/2026238 29 51 58 31 69 0 0 0 0 0 0 0
Totale 566