Power electronic modules are realized by integrating several semiconductor chips inside one package. In this paper, a new thermal modeling procedure and its application to a power electronic module are presented. The adopted modeling strategy consists of the derivation of numerical thermal impedances by 3-D finite element models, validated by comparison with available experimental data, and of the coefficients identification of the RC passive network, through a specific topology, here introduced, to obtain a lumped parameter model of the thermal behavior of the module.
Titolo: | Lumped parameter modeling for thermal characterization of high-power modules |
Autori interni: | |
Data di pubblicazione: | 2014 |
Rivista: | |
Handle: | http://hdl.handle.net/20.500.11769/15516 |
Appare nelle tipologie: | 1.1 Articolo in rivista |
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