The polycondensation reactions between 4,4′-[sulphonyl bis(p-benzoyl)(p-phenyleneoxy)]dibenzoic acid (I) and p-phenylenediamine (II), 1,5-diaminonaphthalene (III) 4,4′-sulphonyldianiline (IV), 4,4′-diaminodiphenylsulphide (V) 4,4′-methylenedianiline (VI) and 4,4′-oxydianiline (VII) to form aromatic polyamides containing sulphone, ether and ketone linkages were attempted by a solid-solid interaction route. A stoichiometnc 1:1 molar ratio of solid reactants was dynamically heated directly in a TG/DSC apparatus, and simultaneous TG/FT-IR was performed to interpret the mechanism of reaction. The results suggest that the polycondensation is dependent on the diamine used. The formation of polyamide was successful when I interacted with II, III, VI and VII. The interaction with IV and V was in part successful because partial decarboxylation of the diacid, made unstable by the diamine, occurred before the condensation reaction.

The Preparation by Solid-Solid Interaction Route of Aromatic Polyamide Materials Containing Sulphone, Ether and Ketone Linkages

POLLICINO, Antonino;
1997-01-01

Abstract

The polycondensation reactions between 4,4′-[sulphonyl bis(p-benzoyl)(p-phenyleneoxy)]dibenzoic acid (I) and p-phenylenediamine (II), 1,5-diaminonaphthalene (III) 4,4′-sulphonyldianiline (IV), 4,4′-diaminodiphenylsulphide (V) 4,4′-methylenedianiline (VI) and 4,4′-oxydianiline (VII) to form aromatic polyamides containing sulphone, ether and ketone linkages were attempted by a solid-solid interaction route. A stoichiometnc 1:1 molar ratio of solid reactants was dynamically heated directly in a TG/DSC apparatus, and simultaneous TG/FT-IR was performed to interpret the mechanism of reaction. The results suggest that the polycondensation is dependent on the diamine used. The formation of polyamide was successful when I interacted with II, III, VI and VII. The interaction with IV and V was in part successful because partial decarboxylation of the diacid, made unstable by the diamine, occurred before the condensation reaction.
1997
Aromatic polyamide materials containing sulphone; Polycondensation reactions; Solid-solid interaction
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.11769/21238
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