This brief demonstrates a fully contactless wafer-level testing based on UHF radio identification (RFID) technology enriched by high-quality on-chip antenna. The antenna, which uses exactly the same tag IC area (i.e., 0.45 mm2), exploits a low-cost post-process consisting of a thick dielectric layer and a copper metal, thus significantly improving the quality factor with respect to a standard CMOS implementation. Contactless wafer-level testing of a tag array is performed by simultaneous inductive coupling with a customized near-field reader. With a 27-dBm standard UHF RFID reader, a reading range up to 2.5 mm is demonstrated at 865 MHz. Anti-collision algorithm and memorized x-y device coordinates allow IC identification on the wafer under test to be achieved. Thanks to its cost-effectiveness, the proposed approach can be easily extended to general purpose IC contactless testing.

Wafer-Level Contactless Testing based on UHF RFID Tags with Post-Process On-Chip Antennas

Ragonese, Egidio
;
Palmisano, Giuseppe
2018

Abstract

This brief demonstrates a fully contactless wafer-level testing based on UHF radio identification (RFID) technology enriched by high-quality on-chip antenna. The antenna, which uses exactly the same tag IC area (i.e., 0.45 mm2), exploits a low-cost post-process consisting of a thick dielectric layer and a copper metal, thus significantly improving the quality factor with respect to a standard CMOS implementation. Contactless wafer-level testing of a tag array is performed by simultaneous inductive coupling with a customized near-field reader. With a 27-dBm standard UHF RFID reader, a reading range up to 2.5 mm is demonstrated at 865 MHz. Anti-collision algorithm and memorized x-y device coordinates allow IC identification on the wafer under test to be achieved. Thanks to its cost-effectiveness, the proposed approach can be easily extended to general purpose IC contactless testing.
CMOS integrated circuits;integrated circuit testing;Q-factor;radiofrequency identification;UHF antennas;UHF integrated circuits;customized near-field reader;IC identification;general purpose IC contactless testing;wafer-level contactless testing;UHF RFID tags;fully contactless wafer-level testing;UHF radio identification technology;high-quality on-chip antenna;dielectric layer;copper metal;quality factor;standard CMOS implementation;tag array;simultaneous inductive coupling;standard UHF RFID reader;post-process on-chip antennas;tag IC area;low-cost post-process;anti-collision algorithm;memorized x-y device;wafer under test;size 2.5 mm;frequency 865.0 MHz;UHF;Antennas;Testing;Integrated circuits;Radiofrequency identification;Couplings;Silicon;Q-factor;CMOS technology;monolithic integrated circuits;near field communication;RFID tags;UHF antennas
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.11769/332261
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