Commercial thermally conductive dielectric materials used in electronic packaging typically exhibit thermal conductivities ranging from κ ~ 0.8 to κ ~ 4.2 W m−1 K−1. Hexagonal boron nitride (h-BN) flakes are promising thermally conductive materials for thermal management of next-generation electronics. We demonstrate a cellulosebased composite embedded with few-layer h-BN flakes, achieving a κ ~ 21.7 W m−1 K−1, prepared using a cost-effective and scalable processing procedure. This value is more than 5 times higher than the thermal conductivity observed in composites embedded with bulk h-BN (κ ~ 4.5 W m−1 K−1), indicating the benefits of the superior thermal conductivity of few-layer h-BN on the thermal conductivity of h-BN polymer composites. When applied as a paste for thermal interface material, the few-layer h-BN composite can reduce the maximum temperature of a heating pad at a power density of h = 2.48 W cm−2 by ΔTmax ~ 24.5 °C compard to bulk h-BN composites at the same h-BN loading. Our results provide an effective approach to improve the thermal conductivity value of cellulose-based thermal pastes for thermal interface materials and demonstrated their viability for the heat dissipation in integrated circuits and highpower electronic devices.

Thermally conductive hexagonal boron nitride/polymer composites for efficient heat transport

Felice Torrisi
Ultimo
Conceptualization
2024-01-01

Abstract

Commercial thermally conductive dielectric materials used in electronic packaging typically exhibit thermal conductivities ranging from κ ~ 0.8 to κ ~ 4.2 W m−1 K−1. Hexagonal boron nitride (h-BN) flakes are promising thermally conductive materials for thermal management of next-generation electronics. We demonstrate a cellulosebased composite embedded with few-layer h-BN flakes, achieving a κ ~ 21.7 W m−1 K−1, prepared using a cost-effective and scalable processing procedure. This value is more than 5 times higher than the thermal conductivity observed in composites embedded with bulk h-BN (κ ~ 4.5 W m−1 K−1), indicating the benefits of the superior thermal conductivity of few-layer h-BN on the thermal conductivity of h-BN polymer composites. When applied as a paste for thermal interface material, the few-layer h-BN composite can reduce the maximum temperature of a heating pad at a power density of h = 2.48 W cm−2 by ΔTmax ~ 24.5 °C compard to bulk h-BN composites at the same h-BN loading. Our results provide an effective approach to improve the thermal conductivity value of cellulose-based thermal pastes for thermal interface materials and demonstrated their viability for the heat dissipation in integrated circuits and highpower electronic devices.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.11769/613830
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