A reactive amino-ended toughener was blended with different commercial epoxy resins namely, diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, diglycidyl p-aminophenol and 1,5-naphthalenediamine as curing agent. The toughener was an aromatic aminoended copolyethersulphone (coPES):poly(ether-sulphone)– poly(etherether-sulphone). The effect of the toughener on the thermal decomposition and char oxidation behaviour of the epoxy resins was studied by the simultaneous differential thermal analysis and thermogravimetric techniques. The glass transition temperature (Tg) as well as characteristic parameters of decomposition, initial decomposition temperature (Ti) and temperature at maximum degradation rate (Tm), in both inert and oxidative environments, were determined in order to verify the influence of toughener on the thermal degradation of the different epoxy systems. It was observed that the presence of coPES maintains the high level thermal stability of the resin and that the glass transition temperature increase with the toughener percentage.

Effects of novel reactive toughening agent on thermal stability of epoxy resin

BLANCO, Ignazio;CICALA, Gianluca;RECCA, Antonino
2012-01-01

Abstract

A reactive amino-ended toughener was blended with different commercial epoxy resins namely, diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, diglycidyl p-aminophenol and 1,5-naphthalenediamine as curing agent. The toughener was an aromatic aminoended copolyethersulphone (coPES):poly(ether-sulphone)– poly(etherether-sulphone). The effect of the toughener on the thermal decomposition and char oxidation behaviour of the epoxy resins was studied by the simultaneous differential thermal analysis and thermogravimetric techniques. The glass transition temperature (Tg) as well as characteristic parameters of decomposition, initial decomposition temperature (Ti) and temperature at maximum degradation rate (Tm), in both inert and oxidative environments, were determined in order to verify the influence of toughener on the thermal degradation of the different epoxy systems. It was observed that the presence of coPES maintains the high level thermal stability of the resin and that the glass transition temperature increase with the toughener percentage.
2012
epoxy resin; toughener; thermal stability; DTA-TG; Copolyethersulphone
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.11769/9720
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