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Titolo Data di pubblicazione Autore(i) File
Breakdown voltages phenomena at molding compound-chip interface 1-gen-2000 Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S file da validare
Moisture corrosion inhibitor layer for Al-alloy metallization layers for electronic devices and corresponding manufacturing method 1-gen-2001 Curro', Giuseppe; Scandurra, Antonino file da validare
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom 1-gen-2001 Zafarana, Roberto; Scandurra, Antonino; Pignataro, Salvatore; Tenya, Yuichi; Yoshizumi, Akira file da validare
Corrosion inhibition of Al metal in microelectronic devices assembled in plastic packages 1-gen-2001 Scandurra, A; Curro, G; Frisina, F; Pignataro, S file da validare
Study of adhesion failure due to molding compound additives at chip surface in electronic devices 1-gen-2001 Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S file da validare
Monolayers of simple organic molecules on silicon studied by surface tools 1-gen-2002 Scandurra, A; Renna, L; Cerofolini, G; Pignataro, S file da validare
Growth process and chemical characterization of an ultrathin phosphate film grafted onto Al-alloy metallization surfaces relevant to microelectronic devices reliability 1-gen-2002 Curro, G; Greco, R; Scandurra, A file da validare
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom 1-gen-2003 Zafarana, Roberto; Scandurra, Antonino; Pignataro, Salvatore; Tenya, Yuichi; Yoshizumi, Akira file da validare
Moisture corrosion inhibitor layer for Al-alloy metallization layers, particularly for electronic devices and corresponding manufacturing method 1-gen-2003 Currò, Giuseppe; Scandurra, Antonino file da validare
Effects of O2 and Ar-Plasma treatments on hydrogen and helium evolution in implanted silicon wafers during annealing 1-gen-2003 D'Urso, Luisa; Gozzo, L; Scandurra, A; Puglisi, O.
Electrical transconduction through organic layers Si-C bonded to silicon substrates 1-gen-2003 Scandurra, A; Indelli, G; Compagnini, Giuseppe Romano; Pignataro, S. file da validare
Ionic Polymer metal composites: manufacture,chemical and electrical characterization 1-gen-2004 Bonomo, C.; Scandurra, A.; Giannone, P.; Graziani, Salvatore; Fortuna, L.; Pignataro, S. file da validare
Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices 1-gen-2004 Scandurra, A; Zafarana, R; Tenya, Y; Pignataro, S file da validare
The role of N in the resputtering inhibition of Si in W-Si-N reactively sputtered thin layers 1-gen-2005 Vomiero, A; BOSCOLO MARCHI, E; Mariotto, G; DELLA MEA, G; Scandurra, A; Puglisi, Orazio Gaetano file da validare
XPS study of the molecular damage of polyimide precursor monomers deposited by glow discharge-induced sublimation 1-gen-2005 G., MAGGIONI T; Negro, E; Carturana, S; Quaranta, A; Scandurra, A; Puglisi, Orazio Gaetano; Della, Meag file da validare
Effects of Heat Treatments on the Properties of Copper Phthalocyanine Films Deposited by Glow-Discharge-Induced Sublimation 1-gen-2006 Maggioni, ; Carturan, S; Tonezzer, M; Bonafini, M; Vomiero, A; Quaranta, A; Maurizio, C; Giannici, ; Scandurra, A; D'Acapito, F; Della, M. E. A. G.; Puglisi, Orazio Gaetano file da validare
New method for the detection of enzyme immobilized on Si-based glucose biosensors 1-gen-2006 Libertino, S; Aiello, V; Fiorenza, P; Fichera, M; Scandurra, A; Sinatra, Fulvia
Properties of Au/Si nanostructured films obtained by jet cooled cluster beam deposition 1-gen-2006 Compagnini, Giuseppe Romano; D'Urso, Luisa; Cataliotti, R. S.; Puglisi, O.; Scandurra, A.; LA FATA, P. file da validare
Curing and electrical conductivity of conductive glues for die attach in microelectronics 1-gen-2006 Scandurra, A; Cavallaro, A; Pignataro, S; Tiziani, R; Gobbato, L; Cognetti, C file da validare
Structural properties of reactively sputtered W-Si-N thin films 1-gen-2007 Vomiero, A; BOSCOLO MARCHI E., QUARANTA A; Della, Mea; G, ; Brusa, R. S.; Mariotto, G; Felisari, L; Frabboni, S; Tonini, R; Ottaviani, G; Mattei, G; Scandurra, A; Puglisi, Orazio Gaetano file da validare
Mostrati risultati da 21 a 40 di 90
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