Sfoglia per Autore
Structural and Electrical Effects on (Al-Si)/n+Si Ohmic Contact of in Situ Silicon Cleaning by Ar Ions Bombardment
file da validare1990-01-01 Santangelo, A.; Lanza, P.; Viscuso, O.; Magro, C.; Scandurra, A.; Licciardello, A.; Torrisi, A.
Structural and Electrical Effects on (A1-Si)/n+Si Ohmic Contact of in Situ Silicon Cleaning by Ar Ions Bombardment
file da validare1991-01-01 Santangelo, A; Lanza, P; Viscuso, O; Magro, C; Scandurra, A; Licciardello, Antonino; Torrisi, A.
Structural and electrical effects od (Al-Si) n+ ohmic contact of in situ silicon cleaning bi Ar+ ion bombardment
file da validare1991-01-01 Santangelo, A; Lanza, P; Viscuso, O; Magro, C; Scandurra, A; Licciardello, A; Torrisi, Alberto
SIMS and SNMS study of the interface between Al-1%Si alloy and sputter cleaned silicon surface
file da validare1992-01-01 Licciardello, Antonino; Torrisi, Alberto; Scandurra, A; Santangelo, A.
Fatigue failure in Pb(95.5)Sn(2)Ag(2.5) solder joints: a combined SIMS/XRD study
file da validare1992-01-01 Scandurra, A.; Torrisi, Alberto; Spoto, Giuseppe; Fragalà, I; Puglisi, O.
Comparison between Air and UV/Ozone Surfaces Passivation Methods of GaAs (100) Substrates
file da validare1992-01-01 Ingo, Gm; Padeletti, G; Mattogno, G; Scandurra, A
FATIGUE FAILURE IN PB-SN-AG ALLOY DURING PLASTIC-DEFORMATION - A 3D-SIMS IMAGING STUDY
file da validare1992-01-01 Scandurra, A; Licciardello, Antonino; Torrisi, Alberto; Lamantia, A; Puglisi, O.
SNMS and imaging SIMS study of the interface between Al99Si1 alloy and sputter cleaned silicon interface
file da validare1992-01-01 Torrisi, Alberto; Scandurra, A; Santangelo, A; Licciardello, A.
DIFFUSION AND ELECTRICAL BEHAVIOR OF AL IMPLANTED INTO CAPPED SI RID C-5307-2009
file da validare1993-01-01 Scandurra, A; Galvagno, G; Raineri, V; Frisina, F; Torrisi, Alberto
AL-BASED PRECIPITATE EVOLUTION DURING HIGH-TEMPERATURE ANNEALING OF AL IMPLANTED IN SI RID C-5307-2009
file da validare1993-01-01 Galvagno, G; Scandurra, A; Raineri, V; Spinella, C; Torrisi, Alberto; Laferla, A; Sciascia, V; Rimini, E.
IMPLANTS OF ALUMINUM INTO SILICON
file da validare1993-01-01 Galvagno, G; Scandurra, A; Raineri, V; Rimini, E; Laferla, A; Sciascia, V; Frisina, F; Raspagliesi, M; Ferla, G
CHARACTERIZATION AND RELIABILITY OF TI/NI/AU, TI/NI/AG AND TI/NI BACK-SIDE METALLIZATIONS IN THE DIE-BONDING OF POWER ELECTRONIC DEVICES
file da validare1994-01-01 Scandurra, A; Porto, A; Mameli, L; Viscuso, O; Delbo, V; Pignataro, S
Evaluation of matrix effects in SIMS quantification of AlxGa1-xAs/GaAs heterostructures - a SNMS approach
file da validare1994-01-01 Torrisi, Alberto; Scandurra, A; Licciardello, Antonino
SIMS MICROPROFILES OF PB-5-PERCENT-SN SOLDER JOINTS IN ELECTRONIC DEVICES AFTER ACCELERATED LIFE TESTS
file da validare1995-01-01 Scandurra, A; Porto, A; Puglisi, O
Wear Effects in Retrieved Acetabular UHMW-PE Cups
file da validare1996-01-01 Ambrosio, G.; Carotenuto, G.; Marletta, Giovanni; Nicolais, L.; Scandurra, A.
Study of adhesion of molding compounds on differently treated copper surfaces
file da validare1996-01-01 Scandurra, A; Zafarana, R; Grasso, A; Pelligra, B; Indelli, Gf
SNMS characterization of ion irradiated GaAs surfaces
file da validare1996-01-01 Scandurra, A; Licciardello, Antonino; Torrisi, Alberto; Weigert, R; Puglisi, O.
More insight into the soft solder die attach
file da validare1997-01-01 Del Bo, V.; Bartels, F.; Scandurra, A.; Luchinger, Ch.; Radek, S.
SNMS quantification of III-V compounds heterostructures
file da validare1997-01-01 Torrisi, Alberto; Cantiano, M; Scandurra, A; Licciardello, Antonino
Improved cell adhesion to ion beam-irradiated polymer surfaces
file da validare1997-01-01 Pignataro, B; Conte, E; Scandurra, A; Marletta, Giovanni
Titolo | Data di pubblicazione | Autore(i) | File |
---|---|---|---|
Structural and Electrical Effects on (Al-Si)/n+Si Ohmic Contact of in Situ Silicon Cleaning by Ar Ions Bombardment | 1-gen-1990 | Santangelo, A.; Lanza, P.; Viscuso, O.; Magro, C.; Scandurra, A.; Licciardello, A.; Torrisi, A. | file da validare |
Structural and Electrical Effects on (A1-Si)/n+Si Ohmic Contact of in Situ Silicon Cleaning by Ar Ions Bombardment | 1-gen-1991 | Santangelo, A; Lanza, P; Viscuso, O; Magro, C; Scandurra, A; Licciardello, Antonino; Torrisi, A. | file da validare |
Structural and electrical effects od (Al-Si) n+ ohmic contact of in situ silicon cleaning bi Ar+ ion bombardment | 1-gen-1991 | Santangelo, A; Lanza, P; Viscuso, O; Magro, C; Scandurra, A; Licciardello, A; Torrisi, Alberto | file da validare |
SIMS and SNMS study of the interface between Al-1%Si alloy and sputter cleaned silicon surface | 1-gen-1992 | Licciardello, Antonino; Torrisi, Alberto; Scandurra, A; Santangelo, A. | file da validare |
Fatigue failure in Pb(95.5)Sn(2)Ag(2.5) solder joints: a combined SIMS/XRD study | 1-gen-1992 | Scandurra, A.; Torrisi, Alberto; Spoto, Giuseppe; Fragalà, I; Puglisi, O. | file da validare |
Comparison between Air and UV/Ozone Surfaces Passivation Methods of GaAs (100) Substrates | 1-gen-1992 | Ingo, Gm; Padeletti, G; Mattogno, G; Scandurra, A | file da validare |
FATIGUE FAILURE IN PB-SN-AG ALLOY DURING PLASTIC-DEFORMATION - A 3D-SIMS IMAGING STUDY | 1-gen-1992 | Scandurra, A; Licciardello, Antonino; Torrisi, Alberto; Lamantia, A; Puglisi, O. | file da validare |
SNMS and imaging SIMS study of the interface between Al99Si1 alloy and sputter cleaned silicon interface | 1-gen-1992 | Torrisi, Alberto; Scandurra, A; Santangelo, A; Licciardello, A. | file da validare |
DIFFUSION AND ELECTRICAL BEHAVIOR OF AL IMPLANTED INTO CAPPED SI RID C-5307-2009 | 1-gen-1993 | Scandurra, A; Galvagno, G; Raineri, V; Frisina, F; Torrisi, Alberto | file da validare |
AL-BASED PRECIPITATE EVOLUTION DURING HIGH-TEMPERATURE ANNEALING OF AL IMPLANTED IN SI RID C-5307-2009 | 1-gen-1993 | Galvagno, G; Scandurra, A; Raineri, V; Spinella, C; Torrisi, Alberto; Laferla, A; Sciascia, V; Rimini, E. | file da validare |
IMPLANTS OF ALUMINUM INTO SILICON | 1-gen-1993 | Galvagno, G; Scandurra, A; Raineri, V; Rimini, E; Laferla, A; Sciascia, V; Frisina, F; Raspagliesi, M; Ferla, G | file da validare |
CHARACTERIZATION AND RELIABILITY OF TI/NI/AU, TI/NI/AG AND TI/NI BACK-SIDE METALLIZATIONS IN THE DIE-BONDING OF POWER ELECTRONIC DEVICES | 1-gen-1994 | Scandurra, A; Porto, A; Mameli, L; Viscuso, O; Delbo, V; Pignataro, S | file da validare |
Evaluation of matrix effects in SIMS quantification of AlxGa1-xAs/GaAs heterostructures - a SNMS approach | 1-gen-1994 | Torrisi, Alberto; Scandurra, A; Licciardello, Antonino | file da validare |
SIMS MICROPROFILES OF PB-5-PERCENT-SN SOLDER JOINTS IN ELECTRONIC DEVICES AFTER ACCELERATED LIFE TESTS | 1-gen-1995 | Scandurra, A; Porto, A; Puglisi, O | file da validare |
Wear Effects in Retrieved Acetabular UHMW-PE Cups | 1-gen-1996 | Ambrosio, G.; Carotenuto, G.; Marletta, Giovanni; Nicolais, L.; Scandurra, A. | file da validare |
Study of adhesion of molding compounds on differently treated copper surfaces | 1-gen-1996 | Scandurra, A; Zafarana, R; Grasso, A; Pelligra, B; Indelli, Gf | file da validare |
SNMS characterization of ion irradiated GaAs surfaces | 1-gen-1996 | Scandurra, A; Licciardello, Antonino; Torrisi, Alberto; Weigert, R; Puglisi, O. | file da validare |
More insight into the soft solder die attach | 1-gen-1997 | Del Bo, V.; Bartels, F.; Scandurra, A.; Luchinger, Ch.; Radek, S. | file da validare |
SNMS quantification of III-V compounds heterostructures | 1-gen-1997 | Torrisi, Alberto; Cantiano, M; Scandurra, A; Licciardello, Antonino | file da validare |
Improved cell adhesion to ion beam-irradiated polymer surfaces | 1-gen-1997 | Pignataro, B; Conte, E; Scandurra, A; Marletta, Giovanni | file da validare |
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