SITTA, ALESSANDRO
 Distribuzione geografica
Continente #
EU - Europa 889
AS - Asia 48
NA - Nord America 20
AF - Africa 16
Totale 973
Nazione #
FR - Francia 739
IT - Italia 123
US - Stati Uniti d'America 18
CI - Costa d'Avorio 13
CN - Cina 13
DE - Germania 11
HK - Hong Kong 10
KR - Corea 6
IE - Irlanda 5
JP - Giappone 4
TW - Taiwan 4
IN - India 3
MY - Malesia 3
AT - Austria 2
EE - Estonia 2
GB - Regno Unito 2
PH - Filippine 2
SG - Singapore 2
UG - Uganda 2
CA - Canada 1
CZ - Repubblica Ceca 1
ET - Etiopia 1
FI - Finlandia 1
GR - Grecia 1
HN - Honduras 1
NL - Olanda 1
RU - Federazione Russa 1
VN - Vietnam 1
Totale 973
Città #
Paris 82
Milan 19
Catania 18
Misterbianco 18
Vittoria 15
Abidjan 13
Central 5
Dublin 5
Florence 5
Dresden 4
Shanghai 4
Verona 4
Casalmaggiore 3
Castel di Sangro 3
Guangzhou 3
Marseille 3
Tainan City 3
Turin 3
Castelnuovo Rangone 2
Columbus 2
Como 2
Dolo 2
George Town 2
Hamburg 2
Kampala 2
Kowloon 2
Los Angeles 2
Mestre 2
Rome 2
Syracuse 2
Trece Martires City 2
Vienna 2
Ashburn 1
Bari 1
Berlin 1
Boardman 1
Bury St Edmunds 1
Capri Leone 1
Caserta 1
Cirié 1
Darmstadt 1
Delhi 1
Dozza 1
Grenoble 1
Ho Chi Minh City 1
Hsinchu 1
Jesolo 1
Jongno-gu 1
Kassel 1
Lappeenranta 1
London 1
Merate 1
Minatomirai 1
Neu-Hohenschoenhausen 1
Piedimonte Etneo 1
Piraeus 1
Pisa 1
Pomezia 1
Puchong Batu Dua Belas 1
Riposto 1
San Diego 1
San Jose 1
Santa Clara 1
Santa Maria a Monte 1
Segrate 1
Sha Tin Wai 1
Stuttgart 1
Suwon 1
Terlizzi 1
Yokohama 1
Yuseong-gu 1
Totale 277
Nome #
Thermo-mechanical Simulation and Experimental Characterization of Power Semiconductor Devices' Packaging Processes, file 261a66fa-76ed-47ef-9b37-96c01cd30472 719
Silver sintering for silicon carbide die attach: Process optimization and structural modeling, file dfe4d22e-829a-bb0a-e053-d805fe0a78d9 98
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device, file dfe4d22e-621f-bb0a-e053-d805fe0a78d9 50
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect, file dfe4d22e-621d-bb0a-e053-d805fe0a78d9 31
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter, file dfe4d22e-50e6-bb0a-e053-d805fe0a78d9 16
Structural characterization of semiconductor multi-layer pad, file dfe4d22e-89b2-bb0a-e053-d805fe0a78d9 10
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization, file dfe4d22e-c2a6-bb0a-e053-d805fe0a78d9 10
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization, file dfe4d22e-94d3-bb0a-e053-d805fe0a78d9 7
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling, file dfe4d22e-9807-bb0a-e053-d805fe0a78d9 6
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction, file dfe4d22e-01f4-bb0a-e053-d805fe0a78d9 5
Mechanical properties of amorphous Ge2Sb2Te5 thin layers, file dfe4d22b-673a-bb0a-e053-d805fe0a78d9 4
The reliability challenge of SiC Power Modules in Automotive Applications, file b2c94adf-a295-4846-af2a-4020c65cc66c 2
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers, file dfe4d229-a09a-bb0a-e053-d805fe0a78d9 2
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow, file 510a8860-020e-48ae-b86b-eecf3b87de99 1
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices, file 81f91ac7-aef1-4cc5-bdb8-0795606e2816 1
Experimental characterization and modeling of power module warpage during assembly process, file a0822392-d41c-4ded-af37-d86f08511bd5 1
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering, file dfe4d22a-2b8b-bb0a-e053-d805fe0a78d9 1
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications, file dfe4d22a-2c93-bb0a-e053-d805fe0a78d9 1
Thermal measurement and numerical analysis for automotive power modules, file dfe4d22d-ea44-bb0a-e053-d805fe0a78d9 1
Mechanical characterization and modeling of different pad structures, file dfe4d22d-f0bf-bb0a-e053-d805fe0a78d9 1
An integrated approach to optimize solder joint reliability, file dfe4d22e-1f1f-bb0a-e053-d805fe0a78d9 1
Mechanical Characterization of Power Electronics Solder Materials, file dfe4d22e-7928-bb0a-e053-d805fe0a78d9 1
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application, file dfe4d22e-8daf-bb0a-e053-d805fe0a78d9 1
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package, file dfe4d22e-9809-bb0a-e053-d805fe0a78d9 1
Silicon carbide die sintering layer: manufacturing process optimization and modeling, file dfe4d22e-d500-bb0a-e053-d805fe0a78d9 1
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis, file dfe4d22e-d6ac-bb0a-e053-d805fe0a78d9 1
Totale 973
Categoria #
all - tutte 1.370
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 1.370


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/20202 0 0 0 0 0 0 0 0 0 0 1 1
2020/20212 0 0 0 2 0 0 0 0 0 0 0 0
2022/2023121 2 1 2 10 18 5 4 7 21 2 37 12
2023/2024847 13 27 18 8 2 395 102 258 11 12 1 0
Totale 973