IRIS
SITTA, ALESSANDRO
 Distribuzione geografica
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Continente #
NA - Nord America 1.767
AS - Asia 903
EU - Europa 832
AF - Africa 191
SA - Sud America 137
OC - Oceania 1
Totale 3.831
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Nazione #
US - Stati Uniti d'America 1.742
SG - Singapore 451
RU - Federazione Russa 376
CN - Cina 216
IT - Italia 175
BR - Brasile 114
CI - Costa d'Avorio 96
IE - Irlanda 95
VN - Vietnam 72
KR - Corea 66
FR - Francia 46
SN - Senegal 45
NG - Nigeria 33
NL - Olanda 30
DE - Germania 22
HK - Hong Kong 21
GB - Regno Unito 20
FI - Finlandia 17
CA - Canada 16
AR - Argentina 14
PL - Polonia 14
JP - Giappone 13
IN - India 12
UA - Ucraina 11
ZA - Sudafrica 8
BD - Bangladesh 7
AT - Austria 6
IQ - Iraq 6
TW - Taiwan 6
ES - Italia 5
MX - Messico 5
SE - Svezia 5
ID - Indonesia 4
PH - Filippine 4
TR - Turchia 4
CL - Cile 3
IR - Iran 3
JO - Giordania 3
KE - Kenya 3
AZ - Azerbaigian 2
BJ - Benin 2
GR - Grecia 2
HR - Croazia 2
KZ - Kazakistan 2
LB - Libano 2
PA - Panama 2
UY - Uruguay 2
UZ - Uzbekistan 2
VE - Venezuela 2
AU - Australia 1
BG - Bulgaria 1
CH - Svizzera 1
CO - Colombia 1
DO - Repubblica Dominicana 1
EC - Ecuador 1
EE - Estonia 1
EG - Egitto 1
GN - Guinea 1
HU - Ungheria 1
IL - Israele 1
KW - Kuwait 1
LT - Lituania 1
MA - Marocco 1
MY - Malesia 1
PK - Pakistan 1
PR - Porto Rico 1
PS - Palestinian Territory 1
SA - Arabia Saudita 1
SK - Slovacchia (Repubblica Slovacca) 1
TH - Thailandia 1
TN - Tunisia 1
Totale 3.831
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Città #
Dallas 526
Singapore 294
Santa Clara 275
Chandler 175
Moscow 170
San Jose 97
Abidjan 96
Dublin 95
Ashburn 84
Hefei 77
Seoul 66
Boardman 58
Chicago 53
Beijing 51
Dakar 45
Los Angeles 38
Lauterbourg 37
Civitanova Marche 28
Amsterdam 25
Cambridge 24
Catania 24
Lawrence 24
Milan 21
Andover 19
Council Bluffs 19
Ho Chi Minh City 19
Hong Kong 19
Lappeenranta 16
New York 16
Abuja 15
Lagos 15
Des Moines 12
Hanoi 12
Tremestieri Etneo 11
Warsaw 11
Denver 10
Orem 10
Falls Church 9
Frankfurt am Main 9
Rome 9
São Paulo 9
Tokyo 9
Wilmington 9
Columbus 8
San Francisco 8
The Dalles 8
Da Nang 7
Houston 7
Toronto 7
Buffalo 6
Duncan 6
Johannesburg 6
Montreal 6
Poplar 6
Seattle 6
Sortino 6
Bologna 5
Jacksonville 5
Manduria 5
Chennai 4
Dhaka 4
New Delhi 4
Nicolosi 4
Nicosia 4
Palermo 4
Stockholm 4
Boston 3
Brasília 3
Brooklyn 3
Esslingen am Neckar 3
Goiânia 3
Hebei 3
Manchester 3
Marseille 3
Messina 3
Nairobi 3
Phủ Lý 3
Port Harcourt 3
Porto Alegre 3
São José 3
Tehran 3
Vienna 3
Yunlin 3
Aci Catena 2
Amman 2
Ankara 2
Arnhem 2
Atlanta 2
Baku 2
Biên Hòa 2
Bordeaux 2
Bremen 2
Cagliari 2
Can Tho 2
Cao Lanh 2
Caserta 2
Central 2
Columbia 2
Cotonou 2
Fairfield 2
Totale 2.856
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Nome #
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 211
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 155
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 154
An integrated approach to optimize solder joint reliability 138
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers 137
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 134
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 132
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 128
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 124
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 121
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 120
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 116
Deep Learning Approach for the Future Advanced Driver Assistance Systems 107
Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules 106
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 106
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 106
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 104
Characterization and simulation of four bending test to estimate resin-copper adhesion 102
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 101
Experimental characterization and modeling of power module warpage during assembly process 94
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 90
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 86
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions 85
Thermal measurement and numerical analysis for automotive power modules 85
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 84
Structural characterization of semiconductor multi-layer pad 78
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 77
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 75
Mechanical characterization and modeling of different pad structures 75
TIMs for transfer molded power modules: Characterization, reliability, and modeling 74
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 72
Silicon carbide die sintering layer: manufacturing process optimization and modeling 70
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 65
Power Module Ceramic Substrates: mechanical characterization and modeling 64
Mechanical Characterization of Power Electronics Solder Materials 63
The reliability challenge of SiC Power Modules in Automotive Applications 60
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 55
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 55
Thermo-mechanical Simulation and Experimental Characterization of Power Semiconductor Devices' Packaging Processes 52
Warpage modeling for semiconductor power module manufacturing flow improvement 45
Electrical Wafer Sorting: a Deep Learning Approach for Advanced Wafer Defect Map Evaluation 3
Dynamic Gate Stress: Impact of duty cycle and gate resistance on automotive grade planar-gate 1200 V SiC MOSFET 3
Totale 3.912
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Categoria #
all - tutte 12.039
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 12.039
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/20219 0 0 0 0 0 0 0 0 0 0 1 8
2021/2022175 3 16 5 2 23 5 30 8 10 7 5 61
2022/2023453 27 41 10 35 42 61 2 110 83 3 22 17
2023/2024216 8 40 7 30 4 38 6 9 4 12 37 21
2024/2025848 41 108 34 45 178 139 25 17 64 70 67 60
2025/20262.154 126 131 590 132 275 456 198 36 107 102 1 0
Totale 3.912