IRIS
SITTA, ALESSANDRO
 Distribuzione geografica
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Continente #
NA - Nord America 1.876
AS - Asia 954
EU - Europa 885
AF - Africa 191
SA - Sud America 142
Continente sconosciuto - Info sul continente non disponibili 81
OC - Oceania 1
Totale 4.130
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Nazione #
US - Stati Uniti d'America 1.842
SG - Singapore 458
RU - Federazione Russa 376
CN - Cina 225
IT - Italia 201
BR - Brasile 117
CI - Costa d'Avorio 96
IE - Irlanda 95
VN - Vietnam 72
KR - Corea 66
FR - Francia 46
SN - Senegal 45
BD - Bangladesh 34
NG - Nigeria 33
NL - Olanda 30
DE - Germania 28
SE - Svezia 25
HK - Hong Kong 22
CA - Canada 21
GB - Regno Unito 21
FI - Finlandia 17
JP - Giappone 15
AR - Argentina 14
PL - Polonia 14
IN - India 12
UA - Ucraina 11
TW - Taiwan 9
ZA - Sudafrica 8
AT - Austria 6
IQ - Iraq 6
MX - Messico 6
ES - Italia 5
ID - Indonesia 5
CL - Cile 4
PH - Filippine 4
TR - Turchia 4
IR - Iran 3
JO - Giordania 3
KE - Kenya 3
AZ - Azerbaigian 2
BJ - Benin 2
CO - Colombia 2
GR - Grecia 2
HR - Croazia 2
KZ - Kazakistan 2
LB - Libano 2
MY - Malesia 2
PA - Panama 2
PR - Porto Rico 2
UY - Uruguay 2
UZ - Uzbekistan 2
VE - Venezuela 2
AG - Antigua e Barbuda 1
AU - Australia 1
BG - Bulgaria 1
CH - Svizzera 1
DO - Repubblica Dominicana 1
EC - Ecuador 1
EE - Estonia 1
EG - Egitto 1
GN - Guinea 1
HU - Ungheria 1
IL - Israele 1
KW - Kuwait 1
LT - Lituania 1
MA - Marocco 1
PK - Pakistan 1
PS - Palestinian Territory 1
SA - Arabia Saudita 1
SK - Slovacchia (Repubblica Slovacca) 1
TH - Thailandia 1
TN - Tunisia 1
TT - Trinidad e Tobago 1
Totale 4.049
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Città #
Dallas 528
Singapore 294
Santa Clara 275
Chandler 175
Moscow 170
San Jose 150
Abidjan 96
Dublin 95
Ashburn 87
Hefei 77
Seoul 66
Boardman 58
Beijing 53
Chicago 53
Dakar 45
Los Angeles 39
Lauterbourg 37
Civitanova Marche 28
Milan 26
Amsterdam 25
Cambridge 24
Catania 24
Lawrence 24
Hong Kong 20
Andover 19
Council Bluffs 19
Ho Chi Minh City 19
New York 18
Lappeenranta 16
Abuja 15
Lagos 15
Des Moines 12
Hanoi 12
Orem 12
Rome 12
Tremestieri Etneo 11
Warsaw 11
Denver 10
Falls Church 9
Frankfurt am Main 9
São Paulo 9
Tokyo 9
Wilmington 9
Columbus 8
Houston 8
San Francisco 8
The Dalles 8
Bologna 7
Buffalo 7
Da Nang 7
Toronto 7
Duncan 6
Johannesburg 6
Montreal 6
Poplar 6
Seattle 6
Sortino 6
Jacksonville 5
Manduria 5
Boston 4
Brooklyn 4
Chennai 4
Dhaka 4
New Delhi 4
Nicolosi 4
Nicosia 4
Palermo 4
Stockholm 4
Berlin 3
Brasília 3
Esslingen am Neckar 3
Figino 3
Goiânia 3
Hebei 3
London 3
Manchester 3
Marseille 3
Messina 3
Mexico City 3
Nairobi 3
Naples 3
Phủ Lý 3
Port Harcourt 3
Porto Alegre 3
Stuttgart 3
São José 3
Tehran 3
Vienna 3
Yunlin 3
Aci Catena 2
Amman 2
Ankara 2
Arnhem 2
Atlanta 2
Augusta 2
Baku 2
Biên Hòa 2
Bordeaux 2
Bremen 2
Cagliari 2
Totale 2.942
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Nome #
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 218
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 162
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 159
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 146
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers 143
An integrated approach to optimize solder joint reliability 141
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 135
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 131
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 131
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 131
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 126
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 124
Deep Learning Approach for the Future Advanced Driver Assistance Systems 116
Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules 110
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 109
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 109
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 108
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 105
Characterization and simulation of four bending test to estimate resin-copper adhesion 104
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 102
Experimental characterization and modeling of power module warpage during assembly process 97
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions 90
Thermal measurement and numerical analysis for automotive power modules 88
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 88
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 86
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 81
Structural characterization of semiconductor multi-layer pad 80
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 78
Silicon carbide die sintering layer: manufacturing process optimization and modeling 78
Mechanical characterization and modeling of different pad structures 76
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 75
TIMs for transfer molded power modules: Characterization, reliability, and modeling 74
Power Module Ceramic Substrates: mechanical characterization and modeling 67
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 67
Mechanical Characterization of Power Electronics Solder Materials 64
The reliability challenge of SiC Power Modules in Automotive Applications 63
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 58
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 56
Thermo-mechanical Simulation and Experimental Characterization of Power Semiconductor Devices' Packaging Processes 55
Warpage modeling for semiconductor power module manufacturing flow improvement 50
Dynamic Gate Stress: Impact of duty cycle and gate resistance on automotive grade planar-gate 1200 V SiC MOSFET 46
Electrical Wafer Sorting: a Deep Learning Approach for Advanced Wafer Defect Map Evaluation 3
Totale 4.130
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Categoria #
all - tutte 13.711
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 13.711
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/2022172 0 16 5 2 23 5 30 8 10 7 5 61
2022/2023453 27 41 10 35 42 61 2 110 83 3 22 17
2023/2024216 8 40 7 30 4 38 6 9 4 12 37 21
2024/2025848 41 108 34 45 178 139 25 17 64 70 67 60
2025/20262.300 126 131 590 132 275 456 198 36 107 102 55 92
2026/202772 37 35 0 0 0 0 0 0 0 0 0 0
Totale 4.130