IRIS
SITTA, ALESSANDRO
 Distribuzione geografica
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Continente #
NA - Nord America 1.459
AS - Asia 501
EU - Europa 349
AF - Africa 153
SA - Sud America 105
OC - Oceania 1
Totale 2.568
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Nazione #
US - Stati Uniti d'America 1.445
SG - Singapore 250
CN - Cina 162
IT - Italia 159
CI - Costa d'Avorio 95
IE - Irlanda 94
BR - Brasile 91
SN - Senegal 45
KR - Corea 38
DE - Germania 16
FI - Finlandia 16
RU - Federazione Russa 14
CA - Canada 11
HK - Hong Kong 10
UA - Ucraina 8
AR - Argentina 7
GB - Regno Unito 7
PL - Polonia 7
AT - Austria 6
JP - Giappone 6
NG - Nigeria 6
VN - Vietnam 6
BD - Bangladesh 5
FR - Francia 5
NL - Olanda 5
IN - India 4
TW - Taiwan 4
ZA - Sudafrica 4
CL - Cile 3
ES - Italia 3
PH - Filippine 3
AZ - Azerbaigian 2
GR - Grecia 2
HR - Croazia 2
ID - Indonesia 2
LB - Libano 2
SE - Svezia 2
TR - Turchia 2
AU - Australia 1
BG - Bulgaria 1
CH - Svizzera 1
CO - Colombia 1
EC - Ecuador 1
EE - Estonia 1
GN - Guinea 1
IQ - Iraq 1
KE - Kenya 1
KZ - Kazakistan 1
MA - Marocco 1
MX - Messico 1
PA - Panama 1
PK - Pakistan 1
PR - Porto Rico 1
PS - Palestinian Territory 1
UY - Uruguay 1
UZ - Uzbekistan 1
VE - Venezuela 1
Totale 2.568
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Città #
Dallas 523
Santa Clara 273
Chandler 175
Singapore 173
Abidjan 95
Dublin 94
Hefei 77
Boardman 58
Chicago 53
Dakar 45
Seoul 38
Beijing 35
Civitanova Marche 28
Ashburn 26
Los Angeles 25
Cambridge 24
Lawrence 24
Catania 23
Milan 21
Andover 19
Lappeenranta 16
Des Moines 12
Tremestieri Etneo 11
Falls Church 9
Wilmington 9
Columbus 8
Hong Kong 8
Rome 8
The Dalles 8
Toronto 7
Abuja 6
Council Bluffs 6
Duncan 6
San Francisco 6
Sortino 6
Jacksonville 5
Manduria 5
São Paulo 5
Warsaw 5
Nicolosi 4
Nicosia 4
Palermo 4
Seattle 4
Dhaka 3
Esslingen am Neckar 3
Frankfurt am Main 3
Hebei 3
Johannesburg 3
Vienna 3
Yunlin 3
Aci Catena 2
Arnhem 2
Baku 2
Brasília 2
Bremen 2
Brooklyn 2
Cagliari 2
Can Tho 2
Caserta 2
Central 2
Chennai 2
Columbia 2
Denver 2
Fairfield 2
Giarre 2
Goiânia 2
Graz 2
Manaus 2
Marikina City 2
Marseille 2
Montreal 2
Munich 2
Nanjing 2
Nova Iguaçu 2
Ottawa 2
Paranaguá 2
Piraeus 2
Portland 2
Porto Alegre 2
Rheine 2
Scicli 2
Stockholm 2
São José 2
Tokyo 2
Vitória de Santo Antão 2
Zagreb 2
Aci Castello 1
Aktobe 1
Alta Floresta 1
Alumínio 1
Amsterdam 1
Angatuba 1
Ankara 1
Annapolis 1
Aracati 1
Atlanta 1
Avellino 1
Baghdad 1
Baltimore 1
Baturité 1
Totale 2.098
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Nome #
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 170
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 106
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 98
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 97
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 96
An integrated approach to optimize solder joint reliability 91
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 89
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers 87
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 78
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 75
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 74
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 73
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 72
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 71
Deep Learning Approach for the Future Advanced Driver Assistance Systems 70
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 69
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 66
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 65
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 63
Thermal measurement and numerical analysis for automotive power modules 63
Mechanical characterization and modeling of different pad structures 61
Structural characterization of semiconductor multi-layer pad 57
Silicon carbide die sintering layer: manufacturing process optimization and modeling 57
Experimental characterization and modeling of power module warpage during assembly process 56
Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules 55
Characterization and simulation of four bending test to estimate resin-copper adhesion 54
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 54
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 52
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions 50
TIMs for transfer molded power modules: Characterization, reliability, and modeling 50
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 50
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 50
Power Module Ceramic Substrates: mechanical characterization and modeling 49
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 44
Mechanical Characterization of Power Electronics Solder Materials 44
The reliability challenge of SiC Power Modules in Automotive Applications 43
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 42
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 41
Thermo-mechanical Simulation and Experimental Characterization of Power Semiconductor Devices' Packaging Processes 35
Warpage modeling for semiconductor power module manufacturing flow improvement 30
Totale 2.647
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Categoria #
all - tutte 9.774
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 9.774
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202133 0 0 0 0 5 0 6 10 1 2 1 8
2021/2022175 3 16 5 2 23 5 30 8 10 7 5 61
2022/2023453 27 41 10 35 42 61 2 110 83 3 22 17
2023/2024216 8 40 7 30 4 38 6 9 4 12 37 21
2024/2025848 41 108 34 45 178 139 25 17 64 70 67 60
2025/2026889 126 131 590 42 0 0 0 0 0 0 0 0
Totale 2.647