IRIS
SITTA, ALESSANDRO
 Distribuzione geografica
Salva come PNG Salva come JPEG
Continente #
NA - Nord America 1.565
EU - Europa 755
AS - Asia 733
AF - Africa 159
SA - Sud America 123
OC - Oceania 1
Totale 3.336
Salva come PNG Salva come JPEG
Nazione #
US - Stati Uniti d'America 1.545
SG - Singapore 404
RU - Federazione Russa 376
CN - Cina 201
IT - Italia 162
BR - Brasile 103
CI - Costa d'Avorio 95
IE - Irlanda 94
SN - Senegal 45
KR - Corea 41
VN - Vietnam 26
NL - Olanda 25
DE - Germania 18
FI - Finlandia 16
CA - Canada 15
GB - Regno Unito 14
PL - Polonia 14
HK - Hong Kong 12
AR - Argentina 11
JP - Giappone 11
UA - Ucraina 9
IN - India 7
ZA - Sudafrica 7
AT - Austria 6
NG - Nigeria 6
BD - Bangladesh 5
ES - Italia 5
FR - Francia 5
TW - Taiwan 4
CL - Cile 3
ID - Indonesia 3
IR - Iran 3
PH - Filippine 3
SE - Svezia 3
AZ - Azerbaigian 2
BJ - Benin 2
GR - Grecia 2
HR - Croazia 2
IQ - Iraq 2
LB - Libano 2
MX - Messico 2
PA - Panama 2
TR - Turchia 2
UY - Uruguay 2
VE - Venezuela 2
AU - Australia 1
BG - Bulgaria 1
CH - Svizzera 1
CO - Colombia 1
EC - Ecuador 1
EE - Estonia 1
GN - Guinea 1
IL - Israele 1
KE - Kenya 1
KZ - Kazakistan 1
LT - Lituania 1
MA - Marocco 1
PK - Pakistan 1
PR - Porto Rico 1
PS - Palestinian Territory 1
TN - Tunisia 1
UZ - Uzbekistan 1
Totale 3.336
Salva come PNG Salva come JPEG
Città #
Dallas 523
Santa Clara 273
Singapore 261
Chandler 175
Moscow 170
Abidjan 95
Dublin 94
Hefei 77
Boardman 58
Chicago 53
Ashburn 51
Beijing 49
Dakar 45
Seoul 41
Los Angeles 34
Civitanova Marche 28
Cambridge 24
Catania 24
Lawrence 24
Amsterdam 21
Milan 21
Andover 19
Lappeenranta 16
Des Moines 12
Tremestieri Etneo 11
Warsaw 11
Hong Kong 10
Denver 9
Falls Church 9
New York 9
Rome 9
Wilmington 9
Columbus 8
São Paulo 8
The Dalles 8
San Francisco 7
Tokyo 7
Toronto 7
Abuja 6
Council Bluffs 6
Duncan 6
Ho Chi Minh City 6
Johannesburg 6
Montreal 6
Orem 6
Seattle 6
Sortino 6
Buffalo 5
Frankfurt am Main 5
Jacksonville 5
Manduria 5
Poplar 5
Da Nang 4
Houston 4
Nicolosi 4
Nicosia 4
Palermo 4
San Jose 4
Brasília 3
Brooklyn 3
Chennai 3
Dhaka 3
Esslingen am Neckar 3
Goiânia 3
Hebei 3
Stockholm 3
São José 3
Tehran 3
Vienna 3
Yunlin 3
Aci Catena 2
Arnhem 2
Atlanta 2
Baku 2
Bremen 2
Cagliari 2
Can Tho 2
Caserta 2
Central 2
Columbia 2
Cotonou 2
Fairfield 2
Giarre 2
Graz 2
Hanoi 2
Hải Dương 2
Manaus 2
Manchester 2
Marikina City 2
Marseille 2
Mexico City 2
Montevideo 2
Munich 2
Nanjing 2
New Delhi 2
Nova Iguaçu 2
Ottawa 2
Panama City 2
Paranaguá 2
Phoenix 2
Totale 2.509
Salva come PNG Salva come JPEG
Nome #
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 194
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 140
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 135
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers 124
An integrated approach to optimize solder joint reliability 122
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 122
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 119
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 111
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 110
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 108
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 103
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 96
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 96
Deep Learning Approach for the Future Advanced Driver Assistance Systems 92
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 92
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 90
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 89
Characterization and simulation of four bending test to estimate resin-copper adhesion 88
Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules 85
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 80
Experimental characterization and modeling of power module warpage during assembly process 80
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 79
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 77
Thermal measurement and numerical analysis for automotive power modules 72
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions 71
Mechanical characterization and modeling of different pad structures 69
Structural characterization of semiconductor multi-layer pad 66
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 64
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 64
Silicon carbide die sintering layer: manufacturing process optimization and modeling 63
TIMs for transfer molded power modules: Characterization, reliability, and modeling 62
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 61
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 58
Power Module Ceramic Substrates: mechanical characterization and modeling 57
Mechanical Characterization of Power Electronics Solder Materials 50
The reliability challenge of SiC Power Modules in Automotive Applications 49
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 49
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 48
Thermo-mechanical Simulation and Experimental Characterization of Power Semiconductor Devices' Packaging Processes 43
Warpage modeling for semiconductor power module manufacturing flow improvement 37
Totale 3.415
Salva come PNG Salva come JPEG
Categoria #
all - tutte 11.016
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 11.016
Salva come PNG Salva come JPEG


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202128 0 0 0 0 0 0 6 10 1 2 1 8
2021/2022175 3 16 5 2 23 5 30 8 10 7 5 61
2022/2023453 27 41 10 35 42 61 2 110 83 3 22 17
2023/2024216 8 40 7 30 4 38 6 9 4 12 37 21
2024/2025848 41 108 34 45 178 139 25 17 64 70 67 60
2025/20261.657 126 131 590 132 275 403 0 0 0 0 0 0
Totale 3.415