IRIS
SITTA, ALESSANDRO
 Distribuzione geografica
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Continente #
NA - Nord America 1.852
AS - Asia 925
EU - Europa 836
AF - Africa 191
SA - Sud America 137
OC - Oceania 1
Totale 3.942
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Nazione #
US - Stati Uniti d'America 1.821
SG - Singapore 457
RU - Federazione Russa 376
CN - Cina 224
IT - Italia 178
BR - Brasile 114
CI - Costa d'Avorio 96
IE - Irlanda 95
VN - Vietnam 72
KR - Corea 66
FR - Francia 46
SN - Senegal 45
NG - Nigeria 33
NL - Olanda 30
DE - Germania 22
HK - Hong Kong 22
GB - Regno Unito 21
CA - Canada 20
FI - Finlandia 17
AR - Argentina 14
JP - Giappone 14
PL - Polonia 14
IN - India 12
BD - Bangladesh 11
UA - Ucraina 11
TW - Taiwan 8
ZA - Sudafrica 8
AT - Austria 6
IQ - Iraq 6
MX - Messico 6
ES - Italia 5
SE - Svezia 5
ID - Indonesia 4
PH - Filippine 4
TR - Turchia 4
CL - Cile 3
IR - Iran 3
JO - Giordania 3
KE - Kenya 3
AZ - Azerbaigian 2
BJ - Benin 2
GR - Grecia 2
HR - Croazia 2
KZ - Kazakistan 2
LB - Libano 2
PA - Panama 2
UY - Uruguay 2
UZ - Uzbekistan 2
VE - Venezuela 2
AU - Australia 1
BG - Bulgaria 1
CH - Svizzera 1
CO - Colombia 1
DO - Repubblica Dominicana 1
EC - Ecuador 1
EE - Estonia 1
EG - Egitto 1
GN - Guinea 1
HU - Ungheria 1
IL - Israele 1
KW - Kuwait 1
LT - Lituania 1
MA - Marocco 1
MY - Malesia 1
PK - Pakistan 1
PR - Porto Rico 1
PS - Palestinian Territory 1
SA - Arabia Saudita 1
SK - Slovacchia (Repubblica Slovacca) 1
TH - Thailandia 1
TN - Tunisia 1
TT - Trinidad e Tobago 1
Totale 3.942
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Città #
Dallas 526
Singapore 294
Santa Clara 275
Chandler 175
Moscow 170
San Jose 149
Abidjan 96
Dublin 95
Ashburn 86
Hefei 77
Seoul 66
Boardman 58
Chicago 53
Beijing 52
Dakar 45
Los Angeles 39
Lauterbourg 37
Civitanova Marche 28
Amsterdam 25
Cambridge 24
Catania 24
Lawrence 24
Milan 21
Hong Kong 20
Andover 19
Council Bluffs 19
Ho Chi Minh City 19
New York 17
Lappeenranta 16
Abuja 15
Lagos 15
Des Moines 12
Hanoi 12
Orem 12
Tremestieri Etneo 11
Warsaw 11
Denver 10
Falls Church 9
Frankfurt am Main 9
Rome 9
São Paulo 9
Tokyo 9
Wilmington 9
Columbus 8
Houston 8
San Francisco 8
The Dalles 8
Da Nang 7
Toronto 7
Buffalo 6
Duncan 6
Johannesburg 6
Montreal 6
Poplar 6
Seattle 6
Sortino 6
Bologna 5
Jacksonville 5
Manduria 5
Brooklyn 4
Chennai 4
Dhaka 4
New Delhi 4
Nicolosi 4
Nicosia 4
Palermo 4
Stockholm 4
Boston 3
Brasília 3
Esslingen am Neckar 3
Goiânia 3
Hebei 3
London 3
Manchester 3
Marseille 3
Messina 3
Mexico City 3
Nairobi 3
Phủ Lý 3
Port Harcourt 3
Porto Alegre 3
São José 3
Tehran 3
Vienna 3
Yunlin 3
Aci Catena 2
Amman 2
Ankara 2
Arnhem 2
Atlanta 2
Baku 2
Biên Hòa 2
Bordeaux 2
Bremen 2
Cagliari 2
Can Tho 2
Cao Lanh 2
Caserta 2
Central 2
Columbia 2
Totale 2.920
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Nome #
Dynamic Gate Stress: Advanced Characterization of an Automotive Grade Planar-Gate 1200 V SiC MOSFET 213
An Integrated Approach to Optimize Power Device Performances by Means of Stress Engineering 157
Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications 156
An integrated approach to optimize solder joint reliability 140
Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge 2 Sb 2 Te 5 layers 139
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates 138
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis 134
Mechanical properties of amorphous Ge2Sb2Te5 thin layers 131
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow 130
Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module under Several Operating Condition 130
Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device 125
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization 123
Deep Learning Approach for the Future Advanced Driver Assistance Systems 112
Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules 109
Integrated electromagnetic-thermal approach to simulate a gan-based monolithic half-bridge for automotive dc-dc converter 108
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application 107
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices 106
Characterization and simulation of four bending test to estimate resin-copper adhesion 103
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module 103
Experimental characterization and modeling of power module warpage during assembly process 96
Fast Liquid-To-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package 94
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions 89
Thermal measurement and numerical analysis for automotive power modules 87
Silver sintering for silicon carbide die attach: Process optimization and structural modeling 87
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling 86
Structural characterization of semiconductor multi-layer pad 80
Reliability and Thermal Analysis of ACEPACK SMIT Power Module 78
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment 77
Mechanical characterization and modeling of different pad structures 76
TIMs for transfer molded power modules: Characterization, reliability, and modeling 74
Simulation of Dynamic Stresses on High Performance Engine Valve Spring System Considering Coil Clashing Effect 74
Silicon carbide die sintering layer: manufacturing process optimization and modeling 72
Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction 67
Power Module Ceramic Substrates: mechanical characterization and modeling 66
Mechanical Characterization of Power Electronics Solder Materials 64
The reliability challenge of SiC Power Modules in Automotive Applications 61
Warpage behavior on silicon semiconductor device: the impact of thick copper metallization 58
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package 56
Thermo-mechanical Simulation and Experimental Characterization of Power Semiconductor Devices' Packaging Processes 55
Warpage modeling for semiconductor power module manufacturing flow improvement 49
Dynamic Gate Stress: Impact of duty cycle and gate resistance on automotive grade planar-gate 1200 V SiC MOSFET 10
Electrical Wafer Sorting: a Deep Learning Approach for Advanced Wafer Defect Map Evaluation 3
Totale 4.023
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Categoria #
all - tutte 12.818
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 12.818
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/20218 0 0 0 0 0 0 0 0 0 0 0 8
2021/2022175 3 16 5 2 23 5 30 8 10 7 5 61
2022/2023453 27 41 10 35 42 61 2 110 83 3 22 17
2023/2024216 8 40 7 30 4 38 6 9 4 12 37 21
2024/2025848 41 108 34 45 178 139 25 17 64 70 67 60
2025/20262.265 126 131 590 132 275 456 198 36 107 102 55 57
Totale 4.023