This paper reviews state-of-the-art architectures for galvanically isolated DC–DC converters with data transmission for low-power applications. Such applications do not have stringent requirements, in terms of power efficiency, but ask for very compact, highly integrated implementations. To this aim, architecture simplicity is crucial, especially when data transmission and/or output power regulation are required. Since the bottleneck of galvanically isolated systems is the isolation device (i.e., typically a stacked thick oxide or polyimide transformer), the reduction of the number of isolated links, while preserving both power and data functionalities, is the more effective strategy to increase the level of integration, reduce the form factor, and have a lower cost per channel. Specifically, this review compares the pros and cons of different architectures that address this challenge differently from traditional solutions.

Compact Galvanically Isolated Architectures for Low-Power DC-DC Converters with Data Transmission

Ragonese, Egidio
;
Palmisano, Giuseppe
2021-01-01

Abstract

This paper reviews state-of-the-art architectures for galvanically isolated DC–DC converters with data transmission for low-power applications. Such applications do not have stringent requirements, in terms of power efficiency, but ask for very compact, highly integrated implementations. To this aim, architecture simplicity is crucial, especially when data transmission and/or output power regulation are required. Since the bottleneck of galvanically isolated systems is the isolation device (i.e., typically a stacked thick oxide or polyimide transformer), the reduction of the number of isolated links, while preserving both power and data functionalities, is the more effective strategy to increase the level of integration, reduce the form factor, and have a lower cost per channel. Specifically, this review compares the pros and cons of different architectures that address this challenge differently from traditional solutions.
2021
amplitude shift keying (ASK); electromagnetic coupling; integrated circuits; multiplexing; polyimide; oxide; rectifiers; Schottky diode; system-in-package (SiP); transformers
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.11769/512377
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