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Titolo Data di pubblicazione Autore(i) File
Structural and Electrical Effects on (Al-Si)/n+Si Ohmic Contact of in Situ Silicon Cleaning by Ar Ions Bombardment 1-gen-1990 Santangelo, A.; Lanza, P.; Viscuso, O.; Magro, C.; Scandurra, A.; Licciardello, A.; Torrisi, A. file da validare
Structural and electrical effects od (Al-Si) n+ ohmic contact of in situ silicon cleaning bi Ar+ ion bombardment 1-gen-1991 Santangelo, A; Lanza, P; Viscuso, O; Magro, C; Scandurra, A; Licciardello, A; Torrisi, Alberto file da validare
Structural and Electrical Effects on (A1-Si)/n+Si Ohmic Contact of in Situ Silicon Cleaning by Ar Ions Bombardment 1-gen-1991 Santangelo, A; Lanza, P; Viscuso, O; Magro, C; Scandurra, A; Licciardello, Antonino; Torrisi, A. file da validare
Fatigue failure in Pb(95.5)Sn(2)Ag(2.5) solder joints: a combined SIMS/XRD study 1-gen-1992 Scandurra, A.; Torrisi, Alberto; Spoto, Giuseppe; Fragalà, I; Puglisi, O. file da validare
Comparison between Air and UV/Ozone Surfaces Passivation Methods of GaAs (100) Substrates 1-gen-1992 Ingo, Gm; Padeletti, G; Mattogno, G; Scandurra, A file da validare
SIMS and SNMS study of the interface between Al-1%Si alloy and sputter cleaned silicon surface 1-gen-1992 Licciardello, Antonino; Torrisi, Alberto; Scandurra, A; Santangelo, A. file da validare
SNMS and imaging SIMS study of the interface between Al99Si1 alloy and sputter cleaned silicon interface 1-gen-1992 Torrisi, Alberto; Scandurra, A; Santangelo, A; Licciardello, A. file da validare
FATIGUE FAILURE IN PB-SN-AG ALLOY DURING PLASTIC-DEFORMATION - A 3D-SIMS IMAGING STUDY 1-gen-1992 Scandurra, A; Licciardello, Antonino; Torrisi, Alberto; Lamantia, A; Puglisi, O. file da validare
AL-BASED PRECIPITATE EVOLUTION DURING HIGH-TEMPERATURE ANNEALING OF AL IMPLANTED IN SI RID C-5307-2009 1-gen-1993 Galvagno, G; Scandurra, A; Raineri, V; Spinella, C; Torrisi, Alberto; Laferla, A; Sciascia, V; Rimini, E. file da validare
DIFFUSION AND ELECTRICAL BEHAVIOR OF AL IMPLANTED INTO CAPPED SI RID C-5307-2009 1-gen-1993 Scandurra, A; Galvagno, G; Raineri, V; Frisina, F; Torrisi, Alberto file da validare
IMPLANTS OF ALUMINUM INTO SILICON 1-gen-1993 Galvagno, G; Scandurra, A; Raineri, V; Rimini, E; Laferla, A; Sciascia, V; Frisina, F; Raspagliesi, M; Ferla, G file da validare
CHARACTERIZATION AND RELIABILITY OF TI/NI/AU, TI/NI/AG AND TI/NI BACK-SIDE METALLIZATIONS IN THE DIE-BONDING OF POWER ELECTRONIC DEVICES 1-gen-1994 Scandurra, A; Porto, A; Mameli, L; Viscuso, O; Delbo, V; Pignataro, S file da validare
Evaluation of matrix effects in SIMS quantification of AlxGa1-xAs/GaAs heterostructures - a SNMS approach 1-gen-1994 Torrisi, Alberto; Scandurra, A; Licciardello, Antonino file da validare
SIMS MICROPROFILES OF PB-5-PERCENT-SN SOLDER JOINTS IN ELECTRONIC DEVICES AFTER ACCELERATED LIFE TESTS 1-gen-1995 Scandurra, A; Porto, A; Puglisi, O file da validare
Study of adhesion of molding compounds on differently treated copper surfaces 1-gen-1996 Scandurra, A; Zafarana, R; Grasso, A; Pelligra, B; Indelli, Gf file da validare
SNMS characterization of ion irradiated GaAs surfaces 1-gen-1996 Scandurra, A; Licciardello, Antonino; Torrisi, Alberto; Weigert, R; Puglisi, O. file da validare
Wear Effects in Retrieved Acetabular UHMW-PE Cups 1-gen-1996 Ambrosio, G.; Carotenuto, G.; Marletta, Giovanni; Nicolais, L.; Scandurra, A. file da validare
More insight into the soft solder die attach 1-gen-1997 Del Bo, V.; Bartels, F.; Scandurra, A.; Luchinger, Ch.; Radek, S. file da validare
SNMS quantification of III-V compounds heterostructures 1-gen-1997 Torrisi, Alberto; Cantiano, M; Scandurra, A; Licciardello, Antonino file da validare
Improved cell adhesion to ion beam-irradiated polymer surfaces 1-gen-1997 Pignataro, B; Conte, E; Scandurra, A; Marletta, Giovanni file da validare
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