Sfoglia per Autore
Thermo-mechanical Simulation and Experimental Characterization of Power Semiconductor Devices' Packaging Processes
2021-02-02 Sitta, Alessandro
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis
2022-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
The reliability challenge of SiC Power Modules in Automotive Applications
file da validare2022-01-01 Calabretta, M.; Sitta, A.; Mauromicale, G.; Rundo, F.; Sequenzia, G.; Messina, A. A.
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices
2022-01-01 Sitta, A.; Mauromicale, G.; Corrente, G.; Messina, A. A.; Rundo, F.; Calabretta, M.; Sequenzia, G.
Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application
2022-01-01 Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G.
Mechanical Characterization of Power Electronics Solder Materials
2022-01-01 Calabretta, M.; Sitta, A.; Messina, A. A.; Oliveri, S. M.; Sequenzia, G.
Silicon carbide die sintering layer: manufacturing process optimization and modeling
2022-01-01 Calabretta, M.; Sitta, A.; Sequenzia, G.
Characterization and simulation of four bending test to estimate resin-copper adhesion
file da validare2023-01-01 Sitta, A.; Mauromicale, G.; Torrisi, M. A.; Sequenzia, G.; D'Arrigo, G.; Calabretta, M.
Reliability and Thermal Analysis of ACEPACK SMIT Power Module
file da validare2023-01-01 Amoroso, D. M.; Mauromicale, G.; Calabretta, M.; Messina, A. A.; D'Arrigo, G.; Sequenzia, G.; Sitta, A.
Warpage modeling for semiconductor power module manufacturing flow improvement
file da validare2023-01-01 Calabretta, M.; Sitta, A.; Rundo, F.; Sequenzia, G.
TIMs for transfer molded power modules: Characterization, reliability, and modeling
file da validare2023-01-01 Sitta, A.; Mauromicale, G.; Malgioglio, G. L.; Amoroso, D. M.; Schifano, B.; Calabretta, M.; Sequenzia, G.
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow
file da validare2023-01-01 Calabretta, M.; Sitta, A.; Messina, A. A.; Olivieri, S. M.; Sequenzia, G.
Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module
file da validare2024-01-01 Donetti, L.; Mauro, S.; Sequenzia, G.; Calabretta, M.; Sitta, A.
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| Thermo-mechanical Simulation and Experimental Characterization of Power Semiconductor Devices' Packaging Processes | 2-feb-2021 | Sitta, Alessandro | |
| Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis | 1-gen-2022 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
| The reliability challenge of SiC Power Modules in Automotive Applications | 1-gen-2022 | Calabretta, M.; Sitta, A.; Mauromicale, G.; Rundo, F.; Sequenzia, G.; Messina, A. A. | file da validare |
| Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices | 1-gen-2022 | Sitta, A.; Mauromicale, G.; Corrente, G.; Messina, A. A.; Rundo, F.; Calabretta, M.; Sequenzia, G. | |
| Fracture Toughness Characterization of Copper-Resin Interface in Power Electronics Application | 1-gen-2022 | Calabretta, M.; Sitta, A.; Oliveri, S. M.; Sequenzia, G. | |
| Mechanical Characterization of Power Electronics Solder Materials | 1-gen-2022 | Calabretta, M.; Sitta, A.; Messina, A. A.; Oliveri, S. M.; Sequenzia, G. | |
| Silicon carbide die sintering layer: manufacturing process optimization and modeling | 1-gen-2022 | Calabretta, M.; Sitta, A.; Sequenzia, G. | |
| Characterization and simulation of four bending test to estimate resin-copper adhesion | 1-gen-2023 | Sitta, A.; Mauromicale, G.; Torrisi, M. A.; Sequenzia, G.; D'Arrigo, G.; Calabretta, M. | file da validare |
| Reliability and Thermal Analysis of ACEPACK SMIT Power Module | 1-gen-2023 | Amoroso, D. M.; Mauromicale, G.; Calabretta, M.; Messina, A. A.; D'Arrigo, G.; Sequenzia, G.; Sitta, A. | file da validare |
| Warpage modeling for semiconductor power module manufacturing flow improvement | 1-gen-2023 | Calabretta, M.; Sitta, A.; Rundo, F.; Sequenzia, G. | file da validare |
| TIMs for transfer molded power modules: Characterization, reliability, and modeling | 1-gen-2023 | Sitta, A.; Mauromicale, G.; Malgioglio, G. L.; Amoroso, D. M.; Schifano, B.; Calabretta, M.; Sequenzia, G. | file da validare |
| Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow | 1-gen-2023 | Calabretta, M.; Sitta, A.; Messina, A. A.; Olivieri, S. M.; Sequenzia, G. | file da validare |
| Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module | 1-gen-2024 | Donetti, L.; Mauro, S.; Sequenzia, G.; Calabretta, M.; Sitta, A. | file da validare |
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