PIGNATARO, Salvatore
 Distribuzione geografica
Continente #
NA - Nord America 263
EU - Europa 98
AF - Africa 27
AS - Asia 9
Totale 397
Nazione #
US - Stati Uniti d'America 261
IE - Irlanda 60
SN - Senegal 21
DE - Germania 16
IT - Italia 14
CI - Costa d'Avorio 6
CN - Cina 4
IN - India 3
RU - Federazione Russa 3
CA - Canada 2
AF - Afghanistan, Repubblica islamica di 1
AT - Austria 1
CH - Svizzera 1
FR - Francia 1
GB - Regno Unito 1
MY - Malesia 1
NL - Olanda 1
Totale 397
Città #
Chandler 129
Dublin 60
Ashburn 46
Dakar 21
Bremen 15
Washington 9
Abidjan 6
Boardman 5
Assago 4
Centuripe 4
Pune 3
Andover 2
Arezzo 2
Beijing 2
Cambridge 2
Jacksonville 2
Lawrence 2
Toronto 2
Amsterdam 1
Bend 1
Biancavilla 1
Catania 1
Cleveland 1
Frankfurt Am Main 1
Jiaxing 1
Kabul 1
Marseille 1
Moscow 1
Nanchang 1
Petaling Jaya 1
Plymouth 1
Rome 1
San Francisco 1
Seattle 1
Wilmington 1
Totale 333
Nome #
Study by electron spectroscopy for chemical analysis of silicon, SiO2 and Si3N4 surfaces treated with various CF4-containing plasmas 34
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom 32
Materials science challenges in green high power density devices 1. The Ag loaded glues for die bonding. 32
Comparison of effects produced on solid surfaces by bombardment with neutrals or ions in the keV range 31
CHARACTERIZATION AND RELIABILITY OF TI/NI/AU, TI/NI/AG AND TI/NI BACK-SIDE METALLIZATIONS IN THE DIE-BONDING OF POWER ELECTRONIC DEVICES 30
Breakdown voltages phenomena at molding compound-chip interface 29
Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices 27
Patterned metallizations in perfluorosulphonate membranes by printing methods 26
Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics 26
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom 25
Tantalum nitride thin film resistors by low temperature reactive sputtering for plastic electronics 24
Monolayers of simple organic molecules on silicon studied by surface tools 23
Corrosion inhibition of Al metal in microelectronic devices assembled in plastic packages 22
Curing and electrical conductivity of conductive glues for die attach in microelectronics 21
Study of adhesion failure due to molding compound additives at chip surface in electronic devices 19
Totale 401
Categoria #
all - tutte 1.613
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 1.613


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/20202 2 0 0 0 0 0 0 0 0 0 0 0
2020/20213 0 0 0 0 2 0 0 0 1 0 0 0
2021/202215 2 2 0 0 4 0 2 0 1 0 0 4
2022/2023284 3 40 5 55 21 43 1 46 57 5 4 4
2023/202493 6 6 16 12 18 25 0 10 0 0 0 0
Totale 401